• DocumentCode
    2284723
  • Title

    Basic study of remote disinfection and sterilization effect by using atmospheric microplasma

  • Author

    Shimizu, Kazuo ; Blajan, Marius ; Tatematsu, Shigeki

  • Author_Institution
    Innovation & Joint Res. Center, Shizuoka Univ., Hamamatsu, Japan
  • fYear
    2011
  • fDate
    9-13 Oct. 2011
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Microplasma has advantage of reducing the discharge voltage compared with other atmospheric plasmas. It is generated at atmospheric pressure at only around 1.0 kV, since its discharge gap is in the order of micro-meters. The experiment was performed with air and argon as the process gases, to confirm the influence of different radical species in the microplasma, on the bacteria cultures. The process gas flows through the parallel plate electrodes with holes which were covered with dielectric material, and energized at about 1.0 kV. The active species generated by the dielectric-barrier discharge microplasma flows towards the exposed Escherichia coli on the agar media at a distance of 2 mm from electrodes. The process is known as remote microplasma sterilization method. Microplasma generated by both air and Ar are effective for sterilization. Observation by the SEM images shows the E. coli had a shrunk shape after the microplasma treatment.
  • Keywords
    argon; dielectric materials; discharges (electric); electrodes; plasma applications; scanning electron microscopy; sterilisation (microbiological); Escherichia coli; SEM images; atmospheric microplasma; bacteria cultures; dielectric material; dielectric-barrier discharge microplasma flow; discharge gap; micrometers; microplasma treatment; parallel plate electrodes; radical species; remote disinfection effect; remote microplasma sterilization method; Argon; Artificial intelligence; Computers; Discharges; Electrodes; Microplasma; dielectric barrier discharge; sterilization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Society Annual Meeting (IAS), 2011 IEEE
  • Conference_Location
    Orlando, FL
  • ISSN
    0197-2618
  • Print_ISBN
    978-1-4244-9498-9
  • Type

    conf

  • DOI
    10.1109/IAS.2011.6074269
  • Filename
    6074269