DocumentCode
2284723
Title
Basic study of remote disinfection and sterilization effect by using atmospheric microplasma
Author
Shimizu, Kazuo ; Blajan, Marius ; Tatematsu, Shigeki
Author_Institution
Innovation & Joint Res. Center, Shizuoka Univ., Hamamatsu, Japan
fYear
2011
fDate
9-13 Oct. 2011
Firstpage
1
Lastpage
6
Abstract
Microplasma has advantage of reducing the discharge voltage compared with other atmospheric plasmas. It is generated at atmospheric pressure at only around 1.0 kV, since its discharge gap is in the order of micro-meters. The experiment was performed with air and argon as the process gases, to confirm the influence of different radical species in the microplasma, on the bacteria cultures. The process gas flows through the parallel plate electrodes with holes which were covered with dielectric material, and energized at about 1.0 kV. The active species generated by the dielectric-barrier discharge microplasma flows towards the exposed Escherichia coli on the agar media at a distance of 2 mm from electrodes. The process is known as remote microplasma sterilization method. Microplasma generated by both air and Ar are effective for sterilization. Observation by the SEM images shows the E. coli had a shrunk shape after the microplasma treatment.
Keywords
argon; dielectric materials; discharges (electric); electrodes; plasma applications; scanning electron microscopy; sterilisation (microbiological); Escherichia coli; SEM images; atmospheric microplasma; bacteria cultures; dielectric material; dielectric-barrier discharge microplasma flow; discharge gap; micrometers; microplasma treatment; parallel plate electrodes; radical species; remote disinfection effect; remote microplasma sterilization method; Argon; Artificial intelligence; Computers; Discharges; Electrodes; Microplasma; dielectric barrier discharge; sterilization;
fLanguage
English
Publisher
ieee
Conference_Titel
Industry Applications Society Annual Meeting (IAS), 2011 IEEE
Conference_Location
Orlando, FL
ISSN
0197-2618
Print_ISBN
978-1-4244-9498-9
Type
conf
DOI
10.1109/IAS.2011.6074269
Filename
6074269
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