Title :
Ozone based atomic layer deposition of high-K dielectrics for graphene device applications
Author :
Mordi, G. ; Lee, B. ; Jandhyala, S. ; Kim, J.
Author_Institution :
Dept. of Electr. Eng., Univ. of Texas at Dallas, Richardson, TX, USA
Abstract :
The initial growth mechanism of Al2O3 films deposited by atomic layer deposition (ALD) using trimethylaluminum (TMA) and ozone as a precursor and an oxidant, respectively, on Highly Ordered Pyrolytic graphite (HOPG) has been investigated. Trimethylaluminum (TMA)/water ALD process has been reported to deposit Al2O3 along the step edges of HOPG while ozone process induce nucleation sites leading to a conformal deposition on the basal plane and step edges. Here we demonstrate a uniform and conformal Al2O3 deposited at 25°C from 6 cycles of (TMA)/ozone as a seed layer toward the integration of high-K dielectrics for top-gated graphene devices. Through this decoration of nucleation sites on graphene due to ozone, we investigate the mechanism of the ozone based process.
Keywords :
alumina; atomic layer deposition; graphene; high-k dielectric thin films; nucleation; ozone; Al2O3; TMA-water ALD process; basal plane; conformal deposition; film initial growth mechanism; graphene device applications; high-k dielectrics; highly ordered pyrolytic graphite; nucleation sites; oxidant; ozone based atomic layer deposition; ozone based process; ozone process; seed layer; step edges; temperature 25 degC; top-gated graphene devices; trimethylaluminum;
Conference_Titel :
Nanotechnology (IEEE-NANO), 2010 10th IEEE Conference on
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-7033-4
Electronic_ISBN :
1944-9399
DOI :
10.1109/NANO.2010.5697781