Power/ground layers with EBG structure and ferrite film for noise suppression and power integrity improvement

Author

Mahmood, Farhan Zaheed ; Toyota, Yoshitaka ; Iokibe, Kengo ; Kondo, Koichi ; Yoshida, Shigeyoshi

Author_Institution

Grad. Sch. of Natural Sci. & Technol., Okayama Univ., Okayama, Japan

fYear

2011

fDate

12-14 Dec. 2011

Firstpage

1

Lastpage

4

Abstract

Noise suppression and power integrity (PI) are two requirements for power/ground layers of printed circuit boards (PCBs). We have proposed the application of electromagnetic bandgap (EBG) structure and ferrite film to power/ground layers. In this paper, not only a test board with the proposed structure but three other test boards to be compared were fabricated to measure with a vector network analyzer. The measured data was evaluated for noise-suppression and PI characteristics. Additional evaluation using a commercial circuit simulator was carried out to evaluate noise-suppression and PI characteristics, assuming a real power-supply circuit. Through the evaluation, the test boards with ferrite film including the proposed structure provided sufficient results.

Keywords

network analysers; photonic band gap; printed circuits; EBG structure; PCB; PI characteristics; commercial circuit simulator; electromagnetic bandgap structure; ferrite film; noise suppression evaluation; power integrity improvement; power-ground layers; power-supply circuit; printed circuit boards; vector network analyzer; Electromagnetic interference; Ferrite films; Integrated circuits; Metamaterials; Noise; Periodic structures; Resonant frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE

Conference_Location

Hanzhou

ISSN

2151-1225

Print_ISBN

978-1-4673-2288-1

Electronic_ISBN

2151-1225

Type

conf

DOI

10.1109/EDAPS.2011.6213804

Filename

6213804