• DocumentCode
    2285142
  • Title

    A novel hierarchical radial tree based on constructal theory for PCB power plane

  • Author

    Huang, Huifen ; Liu, Shiyun ; Deng, Liangyong

  • Author_Institution
    Sch. of Electron. & Inf. Eng., South China Univ. of Technol., Guangzhou, China
  • fYear
    2011
  • fDate
    12-14 Dec. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper proposes a hierarchical radial tree distribution network based on constructal theory for optimal direct current performance in printed circuit board power plane. The optimal radial tree dimensions of each order are obtained for optimal voltage drop and resistance. The constraints are the total areas of the plane and the high conductivity paths. The degrees of freedom are the width/length ratio Hi/Li of the constructal block, high conductivity paths ratio Di+1/Di (i=1, 2, etc). According to constructal theory, the optimal performance consists of constructing the giving area in a sequence of building blocks from the smallest size toward larger sizes hierarchically. High assembly level is not necessary. The optimal order is 12 for the designed tree. Then a radial PCB power plane is developed based on the radial tree which illustrates that the designed plane has multifunctions of low voltage drop, current robustness, equidistribution, compactness and effective noise isolation while maintaining a relatively simple design of geometry.
  • Keywords
    printed circuits; trees (mathematics); PCB power plane; constructal block; constructal theory; current robustness; effective noise isolation; equidistribution; hierarchical radial tree distribution network; high conductivity paths; low voltage drop; optimal direct current performance; optimal performance; printed circuit board power plane; Assembly; Conductivity; Current distribution; Noise; Optimized production technology; Resistance; Solids; PCB power plane; Radial tree; constructal theory; power integrity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE
  • Conference_Location
    Hanzhou
  • ISSN
    2151-1225
  • Print_ISBN
    978-1-4673-2288-1
  • Electronic_ISBN
    2151-1225
  • Type

    conf

  • DOI
    10.1109/EDAPS.2011.6213809
  • Filename
    6213809