DocumentCode :
2285239
Title :
Multiple zone inverse diffusion solver for silicon processing
Author :
Wang, Y.S. ; Mastrangelo, C.H.
Author_Institution :
Center for Integrated Sensors & Circuits, Michigan Univ., Ann Arbor, MI, USA
fYear :
1997
fDate :
8-10 Sept. 1997
Firstpage :
241
Lastpage :
244
Abstract :
In this paper we present the implementation and testing of an inverse diffusion solver that determines implant doses and drive-in times for a set of coupled one-dimensional diffusion profiles spreading over several regions of a device. The solver starts with a description of each distinct device diffusion region in terms of a set of junction depth x/sub j/ and peak concentration c/sub s/ specifications, and a simplified description of the process flow. From this information, the solver setups a storage data structure containing the full history of each profile within each region at each process step. Starting from a guess for the dose and drive-in times, the software first fills the storage structure with approximate profiles and then iteratively solves the problem backwards starting from the last diffusion to the first followed by a forward guess correction loop. The backward-forward recursion loop is repeated until errors in x/sub j/ and c/sub s/ are negligible. The solution method was successfully tested with several conventional device structures.
Keywords :
diffusion; doping profiles; elemental semiconductors; finite element analysis; inverse problems; ion implantation; iterative methods; semiconductor doping; semiconductor process modelling; silicon; Si; backward-forward recursion loop; coupled one-dimensional dopant profiles; dose; drive-in time; implantation; iterative method; junction depth; multiple zone inverse diffusion solver; peak concentration; process flow; semiconductor device; silicon processing; software simulation; storage data structure; BiCMOS integrated circuits; Circuit testing; Coupling circuits; Data structures; Implants; Inverse problems; Process design; Semiconductor devices; Silicon; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 1997. SISPAD '97., 1997 International Conference on
Conference_Location :
Cambridge, MA, USA
Print_ISBN :
0-7803-3775-1
Type :
conf
DOI :
10.1109/SISPAD.1997.621382
Filename :
621382
Link To Document :
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