• DocumentCode
    2285239
  • Title

    Multiple zone inverse diffusion solver for silicon processing

  • Author

    Wang, Y.S. ; Mastrangelo, C.H.

  • Author_Institution
    Center for Integrated Sensors & Circuits, Michigan Univ., Ann Arbor, MI, USA
  • fYear
    1997
  • fDate
    8-10 Sept. 1997
  • Firstpage
    241
  • Lastpage
    244
  • Abstract
    In this paper we present the implementation and testing of an inverse diffusion solver that determines implant doses and drive-in times for a set of coupled one-dimensional diffusion profiles spreading over several regions of a device. The solver starts with a description of each distinct device diffusion region in terms of a set of junction depth x/sub j/ and peak concentration c/sub s/ specifications, and a simplified description of the process flow. From this information, the solver setups a storage data structure containing the full history of each profile within each region at each process step. Starting from a guess for the dose and drive-in times, the software first fills the storage structure with approximate profiles and then iteratively solves the problem backwards starting from the last diffusion to the first followed by a forward guess correction loop. The backward-forward recursion loop is repeated until errors in x/sub j/ and c/sub s/ are negligible. The solution method was successfully tested with several conventional device structures.
  • Keywords
    diffusion; doping profiles; elemental semiconductors; finite element analysis; inverse problems; ion implantation; iterative methods; semiconductor doping; semiconductor process modelling; silicon; Si; backward-forward recursion loop; coupled one-dimensional dopant profiles; dose; drive-in time; implantation; iterative method; junction depth; multiple zone inverse diffusion solver; peak concentration; process flow; semiconductor device; silicon processing; software simulation; storage data structure; BiCMOS integrated circuits; Circuit testing; Coupling circuits; Data structures; Implants; Inverse problems; Process design; Semiconductor devices; Silicon; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 1997. SISPAD '97., 1997 International Conference on
  • Conference_Location
    Cambridge, MA, USA
  • Print_ISBN
    0-7803-3775-1
  • Type

    conf

  • DOI
    10.1109/SISPAD.1997.621382
  • Filename
    621382