Low loss hybrid micromachined filter

Author

Mariselvam V, A. ; Raju, B.S. ; Kanthamani, S. ; Abhaikumarsenior, V.

Author_Institution

Electron. & Commun. Eng., Thiagarajar Coll. of Eng., Madurai, India

fYear

2014

fDate

13-14 Feb. 2014

Firstpage

1

Lastpage

4

Abstract

This paper describes the design of micro machined 2-layer structure bandpass filter design at 75-110GHz. A two-layer structure having substrate layer and circuit layer, has been designed and simulated with ground plane on the down wafer and solid substrate supporting the circuit is much stronger and much easier to be fabricated on silicon substrate compared with conventional 3-layer membrane structure. The microwave performances of the filter show less than 1dB insertion loss and enough stop band rejection for W band application.

Keywords

band-pass filters; micromachining; micromechanical devices; millimetre wave filters; W band application; circuit layer; down wafer; frequency 75 GHz to 110 GHz; ground plane; micro machined 2-layer structure bandpass filter design; silicon substrate; solid substrate; stop band rejection; substrate layer; two-layer structure; Cavity resonators; Dielectrics; Microwave circuits; Microwave filters; RLC circuits; Resonator filters; Silicon; Bandpass filter; Micromachining filter; Microwave filters; W-band;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics and Communication Systems (ICECS), 2014 International Conference on

Conference_Location

Coimbatore

Print_ISBN

978-1-4799-2321-2

Type

conf

DOI

10.1109/ECS.2014.6892658

Filename

6892658