DocumentCode :
2285409
Title :
Breakdown characterisation of HEMTs and MESFETs based on a new thermally driven gate model
Author :
Albasha, L. ; Snowden, C.M. ; Pollard, R.D.
Author_Institution :
Inst. of Microwaves & Photonics, Leeds Univ., UK
fYear :
1997
fDate :
8-10 Sept. 1997
Firstpage :
277
Lastpage :
280
Abstract :
This paper presents a physical model and experimental validation for the breakdown process in HEMTs and MESFETs. The model is integrated into a fast quasi-two-dimensional physical simulation. The model takes account of the tunnelling effects in the region of the gate metallization. A new thermal model monitors the channel temperature and controls the tunnelling mechanism. The effects of the substrate conduction on breakdown in HEMTs is highlighted. Experimental results are presented which confirm the physical interpretations of the numerical model.
Keywords :
Schottky gate field effect transistors; electric breakdown; high electron mobility transistors; semiconductor device models; thermal analysis; tunnelling; HEMTs; MESFETs; breakdown characterisation; channel temperature; gate metallization region; numerical model; physical model; quasi-2D physical simulation; substrate conduction; thermally driven gate model; tunnelling effects; Avalanche breakdown; Electric breakdown; Electron mobility; Gate leakage; HEMTs; MESFETs; MODFETs; Substrates; Temperature; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 1997. SISPAD '97., 1997 International Conference on
Conference_Location :
Cambridge, MA, USA
Print_ISBN :
0-7803-3775-1
Type :
conf
DOI :
10.1109/SISPAD.1997.621391
Filename :
621391
Link To Document :
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