Title :
Row-redundancy scheme for high-density flash memory
Author :
Mihara, M. ; Nakayama, T. ; Ohkawa, M. ; Kawai, S. ; Miyawaki, Y. ; Terada, Y. ; Ohi, M. ; Onoda, H. ; Ajika, N. ; Hatanaka, M. ; Miyoshi, H. ; Yoshihara, T.
Author_Institution :
Mitsubishi Electr. Corp., Itami, Japan
Abstract :
Flash memory is recognized as one of the key devices of personal digital assistant and other portable equipment. Rapid expansion of the market is expected because it is estimated that the cost of flash memory will eventually be lower than that of DRAM. However, to achieve low cost, a highly efficient redundancy scheme must be implemented for the chip. Although the same column redundancy scheme used in DRAM and SRAM can be applied to flash memory, conventional row redundancy in which defective word lines are replaced by spare word lines is not suitable. In flash memory, all memory cells in the erase block must be programmed before the erase pulse is applied to the memory array to avoid over-erasure. If the replaced word line is shorted to the adjacent word line, memory cells on the defective word line cannot be programmed even if the replaced word line is selected because the word line is grounded through the adjacent word line.<>
Keywords :
CMOS integrated circuits; codes; decoding; integrated memory circuits; memory architecture; redundancy; CMOS ICs; defective word lines; erase block; erase pulse; gray codes; high-density flash memory; highly efficient redundancy scheme; low cost; memory array; over-erasure; personal digital assistant; portable equipment; programmed; row-redundancy scheme; Binary codes; CMOS technology; Circuits; Costs; Decoding; Flash memory; Hamming distance; Personal digital assistants; Random access memory; Reflective binary codes;
Conference_Titel :
Solid-State Circuits Conference, 1994. Digest of Technical Papers. 41st ISSCC., 1994 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-1844-7
DOI :
10.1109/ISSCC.1994.344692