DocumentCode
2285737
Title
Development of an improved mathematical model of the heating phase of thermoforming process
Author
Chy, Md Murninul Islam ; Boulet, Benoit
Author_Institution
McGill Univ., Montreal, QC, Canada
fYear
2011
fDate
9-13 Oct. 2011
Firstpage
1
Lastpage
8
Abstract
This paper presents an improved mathematical model to represent a more accurate relationship among inputs and outputs of the heating phase of the thermoforming process. The proposed state-space model of the heating phase of thermoforming process can present and explain some incidents which are impossible to explain using the existing model. The main purpose of the paper is to improve the quality of predictions of the system´s output and state through more accurate evaluation of the inputs and system properties. First, the modeling is developed based on the heat transfer method and system´s behaviour. Then, a series of specialized experimental data were compared with the simulation data obtained from the developed model to validate it. All three kind of heat transfer methods (conduction, convection and radiation) are considered in the development of the model of a thermoforming machine. The proposed state space model is simulated using a Simulink model to compare with real time results. The input output relationship of the proposed model almost accurately follows the real time relationship of the inputs and outputs at different operating conditions. The proposed model gives the improved results compared to the existing model with the real time experimental data even there was some discrepancy of the existed model result with the real time data. The accuracy of the proposed model is evidenced by the results.
Keywords
convection; heat conduction; heat radiation; heating; state-space methods; thermoforming; Simulink model; convection; heat conduction; heat radiation; heat transfer method; mathematical model; simulation data; state space model; thermoforming process heating phase; Argon; Heating; Thermoforming; Absorbity; Conduction; Convection; Emissivity; Heating phase; Infrared sensor; Modeling; Radiation heat transfer; Real-time Implementation; Thermoforming process;
fLanguage
English
Publisher
ieee
Conference_Titel
Industry Applications Society Annual Meeting (IAS), 2011 IEEE
Conference_Location
Orlando, FL
ISSN
0197-2618
Print_ISBN
978-1-4244-9498-9
Type
conf
DOI
10.1109/IAS.2011.6074343
Filename
6074343
Link To Document