• DocumentCode
    228579
  • Title

    Design of low-leakage and high writable proposed SRAM cell structure

  • Author

    Nayak, Debasish ; Acharya, D.P. ; Rout, Prakash Kumar ; Mahapatra, K.K.

  • Author_Institution
    Dept. Electron. & Commun. Eng., Nat. Inst. of Technol., Rourkela, India
  • fYear
    2014
  • fDate
    13-14 Feb. 2014
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    The high demand of embedding more and more functionality in a single chip has enforced the use of scaling. As scaling drastically reduce the channel length the leakage current also increases significantly which increases the static power dissipation. A novel 8T-SRAM cell (Leakage Current Reduced SRAM cell) is proposed which reduces the leakage power dissipation significantly in comparison to the conventional 6T-SRAM cell. The cell is designed using GPDK-90 nm technology library and simulated under Cadence Virtuoso design environment. The proposed cell uses a lower voltage than Vdd during standby mode which leads to a reduction of leakage current and hence the static power consumption. The lower voltage is generated using an NMOS which creates a threshold voltage drop when transfer a high logic. The power consumption is found to be 25.02 % lesser than that of conventional six transistors SRAM cell. The stability and the write ability are measured using the N-Curve technique.
  • Keywords
    SRAM chips; leakage currents; logic design; power consumption; N curve technique; NMOS; SRAM cell structure; channel length; leakage current; leakage power dissipation; static power consumption; static power dissipation; threshold voltage drop; MOS devices; SRAM cells; Stability analysis; Switches; Threshold voltage; Transistors; Leakage current; Leakage power; Low power; N-Curve; SINM; SVNM; Static power; WTI; WTV; stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and Communication Systems (ICECS), 2014 International Conference on
  • Conference_Location
    Coimbatore
  • Print_ISBN
    978-1-4799-2321-2
  • Type

    conf

  • DOI
    10.1109/ECS.2014.6892682
  • Filename
    6892682