• DocumentCode
    2286550
  • Title

    Microwave processing of ceramics

  • Author

    Johnson, David L. ; Skamser, D.J. ; Su, Hongye

  • Author_Institution
    Northwestern Univ., Evanston, IL, USA
  • fYear
    1995
  • fDate
    5-8 June 1995
  • Firstpage
    214
  • Abstract
    Summary form only given. We have investigated sintering, both with and without a plasma, reaction bonding of silicon nitride (RBSN), and chemical vapor infiltration (CVI) synthesis of ceramic matrix composites using microwave heating. The sintering rate of alumina in a plasma excited either by microwaves or induction coupling (5 MHz) is significantly greater than with conventional heating. The enhancement is believed to be caused by the creation of excess point defects by the plasma. Both microwave CVI and RBSN seek to take advantage of the temperature gradients inherent in volumetric heating so the reaction or deposition of matrix can take place from the center to the surface, thus enabling a greater degree of reaction than can be obtained by isothermal processing. Experimental and modeling results of these two processes are presented.
  • Keywords
    alumina; ceramics; chemical vapour infiltration; composite materials; materials preparation; microwave heating; silicon compounds; sintering; 5 MHz; Al/sub 2/O/sub 3/; Si/sub 3/N/sub 4/; ceramic matrix composites; ceramics; chemical vapor infiltration; excess point defects; induction coupled plasma; microwave heating; microwave processing; modeling; plasma; reaction bonding; sintering; temperature gradients; thermal runaway; volumetric heating; Ceramics; Circuits; Dielectric losses; Dielectric materials; Electromagnetic heating; Frequency; Plasma applications; Plasma chemistry; Plasma temperature; Transmitters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 1995. IEEE Conference Record - Abstracts., 1995 IEEE International Conference on
  • Conference_Location
    Madison, WI, USA
  • ISSN
    0730-9244
  • Print_ISBN
    0-7803-2669-5
  • Type

    conf

  • DOI
    10.1109/PLASMA.1995.531755
  • Filename
    531755