DocumentCode :
228656
Title :
Design of a 32nm independent gate FinFET based SRAM cell with improved noise margin for low power application
Author :
Rahaman, Mirwaiz ; Mahapatra, Rajat
Author_Institution :
Dept. of Electron. & Commun. Eng., Nat. Inst. of Technol., Durgapur, India
fYear :
2014
fDate :
13-14 Feb. 2014
Firstpage :
1
Lastpage :
5
Abstract :
In this paper Read Noise Margin (RNM), Write Noise margin (WNM) and standby power consumption of two, 6 transistor (6-T) FinFET based SRAM cell is presented. The write ability and RNM has been improved using pass transistor´s and pull up transistor´s back gate voltage without area penalty. For improving the performance, a separate word line WWL is used. Further, the effect of process variation on the SRAM cell performance due to variation in FinFET´s widths, lengths, threshold voltage (Vth) and gate oxide thickness (Tox) was analyzed by Monte Carlo simulation. The simulation was carried out for 1000 values, assuming 3σ equal to 10 percent of the mean value. The whole work was accomplished using PTM (Predictive Technology Model) for 32nm FinFET by HSPICE simulation.
Keywords :
MOSFET; Monte Carlo methods; SPICE; SRAM chips; logic design; power consumption; HSPICE simulation; Monte Carlo simulation; SRAM cell; back gate voltage; independent gate FinFET; low power application; predictive technology model; read noise margin; size 32 nm; standby power consumption; write noise margin; Electronic mail; Logic gates; Random access memory; 6-T SRAM; FinFET; HSPICE; RNM; SRAM; WNM;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics and Communication Systems (ICECS), 2014 International Conference on
Conference_Location :
Coimbatore
Print_ISBN :
978-1-4799-2321-2
Type :
conf
DOI :
10.1109/ECS.2014.6892721
Filename :
6892721
Link To Document :
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