DocumentCode :
2286724
Title :
Introducing surecontact ®: A design concept to improve energy efficiency in copper electrowinning processes
Author :
Wiechmann, Eduardo ; Aqueveque, Pablo ; Vidal, Guillermo ; Henriquez, Jorge
Author_Institution :
Dept. of Electr. Eng., Univ. of Concepcion, Concepcion, Chile
fYear :
2011
fDate :
9-13 Oct. 2011
Firstpage :
1
Lastpage :
6
Abstract :
To improve energy efficiency in copper Electrowinning different technologies have been developed. These include electrode positioning capping boards and 3D grids, electrode spacers, and, segmented intercell bars. This paper introduces a design concept to avoid electrode open circuits and reduce contact resistances. The design is based on a female teeth shape for the contacts on the intercell bar. This leads to improved electrode alignment, reduced contact resistances, easier contact cleaning and ensured electrical contact for the electrodes. It results in lower operational temperature for the electrodes, reduced plant housekeeping, increased lifespan for capping boards and higher rate of grade A copper production. Comparative results presented should be a useful guideline for any type of intercell bar. Improvements in production levels and energy efficiency should reach 2% and 3% respectively. A 3-D finite-element based analysis and industrial measurements are used to verify.
Keywords :
bars; contact resistance; copper; design engineering; electrical contacts; electrowinning; finite element analysis; mechanical contact; 3D finite element analysis; 3D grids; contact cleaning; contact resistance reduction; copper electrowinning processes; design concept; electrode open circuits; electrode positioning capping boards; electrode spacers; energy efficiency improvement; ensured electrical contact; female teeth shape; grade A copper production; improved electrode alignment; industrial measurements; operational temperature; plant housekeeping reduction; segmented intercell bars; surecontact; Copper; Energy efficiency; Resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industry Applications Society Annual Meeting (IAS), 2011 IEEE
Conference_Location :
Orlando, FL
ISSN :
0197-2618
Print_ISBN :
978-1-4244-9498-9
Type :
conf
DOI :
10.1109/IAS.2011.6074396
Filename :
6074396
Link To Document :
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