DocumentCode :
2287362
Title :
Design methodology of large-scale thermoelectric generation: A hierarchical modeling approach in SPICE
Author :
Chen, Min ; Gao, Junling ; Kang, Zhengdong ; Zhang, Jianzhong ; Du, Qungui ; Suzuki, Ryosuke O.
Author_Institution :
Inst. of Energy Technol., Aalborg Univ., Aalborg, Denmark
fYear :
2011
fDate :
9-13 Oct. 2011
Firstpage :
1
Lastpage :
7
Abstract :
A thermoelectric generation system (TEGS) consists of not only thermoelectric modules (TEMs), but also the external load circuitry and the fluidic heat sources. In this paper, a system-level model is proposed in the SPICE-compatible environment to seamlessly integrate the complete fluid-thermal-electric-circuit multiphysics behaviors. Firstly, a quasi one-dimension numerical model for the thermal fluids and their non-uniform temperature distribution as the boundary condition for TEMs is implemented in SPICE using electrothermal analogy. Secondly, the electric field calculation of the previously proposed device-level SPICE model is upgraded to reflect the resistive behaviors of thermoelements, so that the electric connections among spatially distributed TEMs and the load circuitry can be freely combined in the simulation. Thirdly, a hierarchical and TEM-object oriented strategy is developed to make the system modeling and design scalable, flexible, and programmable. To validate the proposed system model, a TEGS including 8 TEMs is constructed. Through comparisons between simulation results and experimental data, it is clear that the cooptimization of the entire TEGS is enabled by the proposed model.
Keywords :
SPICE; electric connectors; fluidics; optimisation; temperature distribution; thermoelectric conversion; SPICE; TEM-object oriented strategy; boundary condition; cooptimization; electric connections; electrothermal analogy; external load circuitry; fluid-thermal-electric-circuit; fluidic heat sources; multiphysics behaviors; nonuniform temperature distribution; quasione-dimension numerical model; thermoelectric generation system; thermoelectric modules; Current measurement; Thermoelectric energy conversion; electrothermal simulation; fluids; modeling; system analysis and design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industry Applications Society Annual Meeting (IAS), 2011 IEEE
Conference_Location :
Orlando, FL
ISSN :
0197-2618
Print_ISBN :
978-1-4244-9498-9
Type :
conf
DOI :
10.1109/IAS.2011.6074430
Filename :
6074430
Link To Document :
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