DocumentCode :
2287910
Title :
Research on integration platform of dual-use core technologies based on open innovation
Author :
Fan, Jian-min ; Hou, Guang-Ming
Author_Institution :
Sch. of Manage. & Econ., Beijing Inst. of Technol., Beijing, China
fYear :
2009
fDate :
14-16 Sept. 2009
Firstpage :
1631
Lastpage :
1637
Abstract :
Dual-use core technology can be integrated along the entire life cycle of technology because of its value extensibility, while integration of this technology required a corresponding platform. Owing to problems of China status and policy, this platform is closed type. Platform based on innovation should be constructed in China. It is feasible. This platform should be divided into soft-type platform of a variety of management systems, mechanisms and modes of management etc., and hardware platform to ensure technology integration running such as money, talents, entrepreneurs, technologies, knowledge bank, etc. Countermeasures should be done by China government in order to build it, such as to reform military management system, better policies and regulations, improve personnel management, increase capital investment and strengthen risk management and so on.
Keywords :
innovation management; personnel; risk management; technology management; China; China government; capital investment; dual-use core technologies; integration platform; management systems; open innovation; personnel management; reform military management system; risk management; technology integration; Conference management; Engineering management; Financial management; Innovation management; Investments; Knowledge management; Resource management; Risk management; Technological innovation; Technology management; core technology integration; dual-use technology; open innovation; supporting platform;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Management Science and Engineering, 2009. ICMSE 2009. International Conference on
Conference_Location :
Moscow
Print_ISBN :
978-1-4244-3970-6
Electronic_ISBN :
978-1-4244-3971-3
Type :
conf
DOI :
10.1109/ICMSE.2009.5317809
Filename :
5317809
Link To Document :
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