• DocumentCode
    2287910
  • Title

    Research on integration platform of dual-use core technologies based on open innovation

  • Author

    Fan, Jian-min ; Hou, Guang-Ming

  • Author_Institution
    Sch. of Manage. & Econ., Beijing Inst. of Technol., Beijing, China
  • fYear
    2009
  • fDate
    14-16 Sept. 2009
  • Firstpage
    1631
  • Lastpage
    1637
  • Abstract
    Dual-use core technology can be integrated along the entire life cycle of technology because of its value extensibility, while integration of this technology required a corresponding platform. Owing to problems of China status and policy, this platform is closed type. Platform based on innovation should be constructed in China. It is feasible. This platform should be divided into soft-type platform of a variety of management systems, mechanisms and modes of management etc., and hardware platform to ensure technology integration running such as money, talents, entrepreneurs, technologies, knowledge bank, etc. Countermeasures should be done by China government in order to build it, such as to reform military management system, better policies and regulations, improve personnel management, increase capital investment and strengthen risk management and so on.
  • Keywords
    innovation management; personnel; risk management; technology management; China; China government; capital investment; dual-use core technologies; integration platform; management systems; open innovation; personnel management; reform military management system; risk management; technology integration; Conference management; Engineering management; Financial management; Innovation management; Investments; Knowledge management; Resource management; Risk management; Technological innovation; Technology management; core technology integration; dual-use technology; open innovation; supporting platform;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Management Science and Engineering, 2009. ICMSE 2009. International Conference on
  • Conference_Location
    Moscow
  • Print_ISBN
    978-1-4244-3970-6
  • Electronic_ISBN
    978-1-4244-3971-3
  • Type

    conf

  • DOI
    10.1109/ICMSE.2009.5317809
  • Filename
    5317809