DocumentCode :
2288143
Title :
Interactions of fluorine redistribution and nitrogen incorporation with boron diffusion in silicon dioxide
Author :
Navi, M. ; Dunham, S.
Author_Institution :
Dept. of Electr. & Comput. Eng., Boston Univ., MA, USA
fYear :
1997
fDate :
8-10 Sept. 1997
Firstpage :
335
Lastpage :
338
Abstract :
This work investigates the effect of composition of gate dielectric on boron diffusion. Gate oxides were grown with nitrogen contents varying from 0 to 1.4%. A series of SIMS measurement were carried out to measure the depth profile of incorporated nitrogen and fluorine. Capacitance voltage measurements were used to determine the amount of boron penetration. Also, to better understand the role of fluorine, experiments were carried out to investigate the redistribution of fluorine in the poly/SiO/sub 2//Si system. Finally a model is proposed that accounts for diffusion of boron as a function of local impurity concentration in gate dielectric.
Keywords :
boron; diffusion; fluorine; impurities; impurity distribution; ion implantation; nitrogen; secondary ion mass spectra; silicon compounds; SIMS depth profile; Si-SiO/sub 2/:B,F,N-Si; boron diffusion; capacitance voltage measurement; fluorine redistribution; gate dielectric composition; local impurity concentration; model; nitrogen incorporation; polysilicon; silicon dioxide; Annealing; Boron; Capacitance-voltage characteristics; Data mining; Dielectric measurements; Etching; Nitrogen; Silicon; Temperature; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 1997. SISPAD '97., 1997 International Conference on
Conference_Location :
Cambridge, MA, USA
Print_ISBN :
0-7803-3775-1
Type :
conf
DOI :
10.1109/SISPAD.1997.621406
Filename :
621406
Link To Document :
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