• DocumentCode
    2288143
  • Title

    Interactions of fluorine redistribution and nitrogen incorporation with boron diffusion in silicon dioxide

  • Author

    Navi, M. ; Dunham, S.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Boston Univ., MA, USA
  • fYear
    1997
  • fDate
    8-10 Sept. 1997
  • Firstpage
    335
  • Lastpage
    338
  • Abstract
    This work investigates the effect of composition of gate dielectric on boron diffusion. Gate oxides were grown with nitrogen contents varying from 0 to 1.4%. A series of SIMS measurement were carried out to measure the depth profile of incorporated nitrogen and fluorine. Capacitance voltage measurements were used to determine the amount of boron penetration. Also, to better understand the role of fluorine, experiments were carried out to investigate the redistribution of fluorine in the poly/SiO/sub 2//Si system. Finally a model is proposed that accounts for diffusion of boron as a function of local impurity concentration in gate dielectric.
  • Keywords
    boron; diffusion; fluorine; impurities; impurity distribution; ion implantation; nitrogen; secondary ion mass spectra; silicon compounds; SIMS depth profile; Si-SiO/sub 2/:B,F,N-Si; boron diffusion; capacitance voltage measurement; fluorine redistribution; gate dielectric composition; local impurity concentration; model; nitrogen incorporation; polysilicon; silicon dioxide; Annealing; Boron; Capacitance-voltage characteristics; Data mining; Dielectric measurements; Etching; Nitrogen; Silicon; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 1997. SISPAD '97., 1997 International Conference on
  • Conference_Location
    Cambridge, MA, USA
  • Print_ISBN
    0-7803-3775-1
  • Type

    conf

  • DOI
    10.1109/SISPAD.1997.621406
  • Filename
    621406