DocumentCode
2288164
Title
Dynamic analysis of the spacecraft structure on orbit made up of honeycomb sandwich plates
Author
Hao, Luo ; Geng, Liu ; Shangjun, Ma ; Wenbin, Liu
Author_Institution
Sch. of Mech. Eng., Northwestern Polytech. Univ., Xi´´an, China
Volume
1
fYear
2011
fDate
10-12 June 2011
Firstpage
83
Lastpage
87
Abstract
The honeycomb sandwich plate is applied widely in the modern spacecraft design because of its excellent capability. When the dynamic analysis of the spacecraft structure made up of the honeycomb sandwich plates is performed in ANSYS, the equivalent parameters of the honeycomb sandwich plates have to be identified. Now there have been three equivalent methods, that is called the sandwich theory, the equivalent-plate theory and the honeycomb-plate theory. In this paper these three equivalent methods are studied through a numerical example. The computational results show that the honeycomb-plate theory is the most suitable method to simplify the spacecraft structure. Based on the conclusion, the spacecraft structure is simplified by using the honeycomb-plate theory and the finite element model is established. And then modal analysis and harmonic response analysis of the spacecraft structure are performed. All of the analysis results can accommodate bases for structural design and optimum design of the spacecraft structure.
Keywords
finite element analysis; harmonic analysis; honeycomb structures; modal analysis; plates (structures); sandwich structures; space vehicles; structural engineering; ANSYS; finite element model; harmonic response analysis; honeycomb sandwich plates; honeycomb-plate theory; modal analysis; spacecraft structures dynamic analysis; Acceleration; Finite element methods; Harmonic analysis; Modal analysis; Shape; Space vehicles; Vibrations; finite element model; harmonic response analysis; honeycomb sandwich plate; modal analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Science and Automation Engineering (CSAE), 2011 IEEE International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-8727-1
Type
conf
DOI
10.1109/CSAE.2011.5953175
Filename
5953175
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