DocumentCode :
2290187
Title :
Beyond the qualified manufacturer list (QML)
Author :
Hakim, Edward B. ; Rust, Carl A. ; Olsson, Wisty
Author_Institution :
Army Res. Lab., Ft. Monmouth, NJ, USA
fYear :
1995
fDate :
16-19 Jan 1995
Firstpage :
362
Lastpage :
369
Abstract :
The Microcircuit Application Handbook, MIL-HDBK-179(ER), dated 25 October 1993 is becoming the Army guide for the determination of suitability of a microcircuit packaging approach and the selection criteria for microcircuit suppliers and part types. This document is based on recommendations provided by the DoD Defense Science Board. A multiple entry matrix lists all possible DoD equipment environments, which ranges from temperature humidity controlled to space. Parts for these application environments include commercial and industrial grade plastic encapsulated microcircuits (PEMs), industrial qualification of PEM approaches, and QML. By implementation of the microelectronic selection criteria spreadsheet, the equipment developer provides the rational for selection of the PEM supplier and the part selected. The data required is mainly available through the supplier and should determine if he is implementing best commercial practices (BCP). This data will assure the parts surpass the equipment quality and reliability requirements. This approach to the use of nonmilitary approved microcircuits is already being implemented on several Army programs which are discussed. The vision is to make the handbook a requirement for all equipment developed at the US Army Communications-Electronics Command (CECOM)
Keywords :
encapsulation; integrated circuit packaging; integrated circuits; military equipment; military standards; plastic packaging; quality control; reliability; MIL-HDBK-179(ER); Microcircuit Application Handbook; QML; US Army; best commercial practices; equipment environment; equipment quality; industrial qualification; microcircuit packaging; multiple entry matrix; plastic encapsulated microcircuits; qualified manufacturer list; recommendations; reliability; selection criteria; spreadsheet; Business continuity; Defense industry; Humidity control; Manufacturing; Microelectronics; Packaging machines; Plastics industry; Qualifications; Temperature control; Temperature distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability and Maintainability Symposium, 1995. Proceedings., Annual
Conference_Location :
Washington, DC
ISSN :
0149-144X
Print_ISBN :
0-7803-2470-6
Type :
conf
DOI :
10.1109/RAMS.1995.513270
Filename :
513270
Link To Document :
بازگشت