• DocumentCode
    2290645
  • Title

    Future use intention based on TAM-RI model: A study on Chinese college student credit card

  • Author

    Zou, Peng ; Yu, Bo ; An, Hui

  • Author_Institution
    Sch. of Manage., Harbin Inst. of Technol., Harbin, China
  • fYear
    2009
  • fDate
    14-16 Sept. 2009
  • Firstpage
    703
  • Lastpage
    708
  • Abstract
    In some new industries, firms not only must introduce the new types of products or services but also enhance the customer loyalty so that customers purchase more products or service provided by focal firm. The customer relationship management with the double targets has vital theory and application means. This research built a new future use intention model of the college student credit card customers combining the Repurchase Intention Model with Technology Acceptance Model. This research carries on the survey in view of college student community. Then it draws the conclusion that there are seven factors which influence the future use intention: satisfaction, trust, financial risk, perceptive usefulness, and perceptive ease for use, switch cost and alternative attract. The result of regression analysis shows that the influence degrees from high to low are perceptive ease for use, trust, alternative attract, perceptive useful, satisfaction and financial risk.
  • Keywords
    credit transactions; customer relationship management; marketing; regression analysis; TAM-RI model; credit card; customer loyalty; customer relationship management; future use intention; influence degrees; regression analysis; repurchase intention model; technology acceptance model; Conference management; Costs; Credit cards; Customer relationship management; Educational institutions; Engineering management; Industrial relations; Investments; Switches; Technology management; credit card marketing; customer loyalty; future use intention; repurchase intention; technology accept model;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Management Science and Engineering, 2009. ICMSE 2009. International Conference on
  • Conference_Location
    Moscow
  • Print_ISBN
    978-1-4244-3970-6
  • Electronic_ISBN
    978-1-4244-3971-3
  • Type

    conf

  • DOI
    10.1109/ICMSE.2009.5318245
  • Filename
    5318245