• DocumentCode
    2290934
  • Title

    Exploiting bondwire parasitic impedance in the design of a 1.6 GHz narrow-band CMOS low noise amplifier

  • Author

    Al-Rawi, Ghazi A.

  • Author_Institution
    STAR Lab., Stanford Univ., CA, USA
  • Volume
    2
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    804
  • Abstract
    This paper presents a new technique for efficiently utilizing the parasitic impedance of bondwires in the design of a 1.6 GHz high performance narrow-band Low Noise Amplifier (LNA). Bondwires have reasonably predictable parasitic impedance and have much higher quality factors compared to on-chip spiral inductors. The proposed LNA design uses bondwires to provide the needed inductive reactance and does not use any on-chip spiral inductors. Series capacitors are used to control the inductive reactance of bondwires. HSPICE simulations show that the LNA achieves a noise figure NF of only 2.0 dB in 0.6 μm CMOS process technology. It has S11 of -10.04 dB, S22 of -29.3 dB, S21 of 21.2 dB, input referred IP3 of -8 dBm, and consumes 14.94 mW from a 2.5 V power supply
  • Keywords
    CMOS analogue integrated circuits; Q-factor; UHF amplifiers; UHF integrated circuits; electric impedance; integrated circuit bonding; integrated circuit design; integrated circuit noise; lead bonding; 0.6 micron; 1.6 GHz; 14.94 mW; 2 dB; 2.5 V; CMOS low noise amplifier; RFIC; bondwire parasitic impedance; inductive reactance; narrow-band LNA; quality factors; series capacitors; Bonding; Capacitors; Impedance; Inductors; Low-noise amplifiers; Narrowband; Noise figure; Noise measurement; Q factor; Spirals;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2001. MWSCAS 2001. Proceedings of the 44th IEEE 2001 Midwest Symposium on
  • Conference_Location
    Dayton, OH
  • Print_ISBN
    0-7803-7150-X
  • Type

    conf

  • DOI
    10.1109/MWSCAS.2001.986309
  • Filename
    986309