DocumentCode
2291432
Title
Ultra-low-power high-noise-margin logic with undoped FD SOI devices
Author
Bol, D. ; De Vos, J. ; Flandre, D. ; Legat, J.-D.
Author_Institution
Univ. Catholique de Louvain, Louvain-la-Neuve, Belgium
fYear
2009
fDate
5-8 Oct. 2009
Firstpage
1
Lastpage
2
Abstract
Undoped devices in FD SOI technology provides improved switching speed to ULP logic, while keeping ultra-low leakage. Measurement results in 0.15 mum FD SOI technology show that it can be used to build 500 kHz digital circuits for sensing applications, with 0.95 V noise margins at 1.5 V thanks to the hysteresis property of ULP logic. The record mean leakage current is 86 fA per gate, which enables digital circuits with 100 pW-range stand-by power, without the need for power-gating technique nor subthreshold operation. Additionally, the proposed FD SOI undoped ULP inverters can be used to build ultra-low-leakage 10 T or 12 T SRAM cells with the same architecture as proposed for bulk technology in, with reduced static current (~100 fA) and more compact layout.
Keywords
SRAM chips; logic circuits; logic gates; low-power electronics; silicon-on-insulator; current 86 fA; digital circuits; frequency 500 kHz; power 100 pW; power-gating technique; record mean leakage current; size 0.15 mum; ultra-low-leakage SRAM cell; ultra-low-power high-noise-margin logic; undoped FD SOI devices; undoped ULP inverters; voltage 0.95 V; voltage 1.5 V; CMOS logic circuits; Digital circuits; Frequency; Hysteresis; Logic circuits; Logic devices; Logic gates; MOS devices; Pulse inverters; Ring oscillators;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 2009 IEEE International
Conference_Location
Foster City, CA
ISSN
1078-621X
Print_ISBN
978-1-4244-4256-0
Electronic_ISBN
1078-621X
Type
conf
DOI
10.1109/SOI.2009.5318760
Filename
5318760
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