From silicon direct wafer bonding to surface nano-patterning: a way to innovative substrate elaboration

Self-assembled configurations of nanostructures are expected to play an increasingly important role in devices design, as an alternative to conventional microelectronics technology. Conventional techniques are generally limited by the lack of simultaneous control on positioning, density and size uniformity of the nanostructures. To overcome these problems a new substrate based on controlled direct twist wafer bonding and preferential chemical etching has been developed.