DocumentCode :
2294676
Title :
Business Value Assessment of Packaged Applications
Author :
Tian, Chunhua ; Jiang, Shun ; Cao, RongZeng ; Ding, Wei ; Lee, Juhnyoung
Author_Institution :
IBM China Res. Lab., Beijing
fYear :
2008
fDate :
6-11 July 2008
Firstpage :
67
Lastpage :
70
Abstract :
Unlike others, IT services using packaged applications such as SAP and Oracle modules highly reuse and configure prepackaged software modules. However, the implementation and configuration situation of a packaged application project may significantly differ from another. In this paper, we propose a generic method and model for assessing the cost and benefit of IT services using packaged applications. The proposed method utilizes a questionnaire-based approach to project scoping to capture the heterogeneity. The questionnaire also helps define rules to model the relationship between effort requirements and possible scenarios of packaged application implementation. The proposed method utilizes a rule-based approach to generate cost estimations of given IT service projects. For packaged applications, template data can be pre-defined and customized by using reference process and metrics models, and solution hierarchies. Then, for a given implementation scenario, the business value is estimated by using and customizing the template data. Once the cost and benefit of an IT initiative is assessed as described, other derivative analyses such as business case analyses and pricing can be done by using the estimated costs and business benefits.
Keywords :
business data processing; software packages; IT services; Oracle; SAP; business value assessment; packaged applications; prepackaged software modules; questionnaire-based approach; rule-based approach; Acceleration; Application software; Cost benefit analysis; Investments; Mathematical model; Packaging; Pricing; Service oriented architecture; Software packages; USA Councils; Cost Estimation; Package Application; Value Assessment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Services - Part I, 2008. IEEE Congress on
Conference_Location :
Honolulu, HI
Print_ISBN :
978-0-7695-3286-8
Type :
conf
DOI :
10.1109/SERVICES-1.2008.21
Filename :
4578297
Link To Document :
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