• DocumentCode
    2294676
  • Title

    Business Value Assessment of Packaged Applications

  • Author

    Tian, Chunhua ; Jiang, Shun ; Cao, RongZeng ; Ding, Wei ; Lee, Juhnyoung

  • Author_Institution
    IBM China Res. Lab., Beijing
  • fYear
    2008
  • fDate
    6-11 July 2008
  • Firstpage
    67
  • Lastpage
    70
  • Abstract
    Unlike others, IT services using packaged applications such as SAP and Oracle modules highly reuse and configure prepackaged software modules. However, the implementation and configuration situation of a packaged application project may significantly differ from another. In this paper, we propose a generic method and model for assessing the cost and benefit of IT services using packaged applications. The proposed method utilizes a questionnaire-based approach to project scoping to capture the heterogeneity. The questionnaire also helps define rules to model the relationship between effort requirements and possible scenarios of packaged application implementation. The proposed method utilizes a rule-based approach to generate cost estimations of given IT service projects. For packaged applications, template data can be pre-defined and customized by using reference process and metrics models, and solution hierarchies. Then, for a given implementation scenario, the business value is estimated by using and customizing the template data. Once the cost and benefit of an IT initiative is assessed as described, other derivative analyses such as business case analyses and pricing can be done by using the estimated costs and business benefits.
  • Keywords
    business data processing; software packages; IT services; Oracle; SAP; business value assessment; packaged applications; prepackaged software modules; questionnaire-based approach; rule-based approach; Acceleration; Application software; Cost benefit analysis; Investments; Mathematical model; Packaging; Pricing; Service oriented architecture; Software packages; USA Councils; Cost Estimation; Package Application; Value Assessment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Services - Part I, 2008. IEEE Congress on
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    978-0-7695-3286-8
  • Type

    conf

  • DOI
    10.1109/SERVICES-1.2008.21
  • Filename
    4578297