DocumentCode :
2294977
Title :
RTOK elimination with TSMM
Author :
Swart, Paul W.
Author_Institution :
Unisys, Eagan, MN, USA
fYear :
1991
fDate :
20-24 May 1991
Firstpage :
214
Abstract :
One of the major problems in current technology in the military environment is the identification of failures that occur in airborne electronics while on a mission that cannot be reproduced on the ground-in other words, return tested OK (RTOK). A module that monitors environmental conditions, real time, called the Time Stress Measurement Module (TSMM) is described. TSMM monitors environmental conditions affecting electronics modules and within electronic systems for test, maintenance, and AVIP purposes. The current TSMM provides for monitoring of temperatures, vibration, shock, voltage variations, and transients. The sensor data can be accessed across the PI-bus at any time before, during, or after a mission while the module is installed, allowing an expert system to take extreme environmental conditions and predict failures or correlate that data against failures that have already occurred. The sensor data can be retained after loss of power
Keywords :
aircraft instrumentation; computerised instrumentation; computerised monitoring; environmental testing; expert systems; fault location; military systems; shock measurement; stress measurement; temperature measurement; transients; voltage measurement; PI-bus; RTOK; Time Stress Measurement Module; airborne electronics; electronics modules; environmental conditions; expert system; failures; military electronics; monitoring; real time; repair; return tested OK; shock; temperatures; transients; vibration; voltage variations; Condition monitoring; Electric shock; Electronic equipment testing; Expert systems; Sensor systems; Stress measurement; System testing; Temperature measurement; Temperature sensors; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Aerospace and Electronics Conference, 1991. NAECON 1991., Proceedings of the IEEE 1991 National
Conference_Location :
Dayton, OH
Print_ISBN :
0-7803-0085-8
Type :
conf
DOI :
10.1109/NAECON.1991.165748
Filename :
165748
Link To Document :
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