• DocumentCode
    2294977
  • Title

    RTOK elimination with TSMM

  • Author

    Swart, Paul W.

  • Author_Institution
    Unisys, Eagan, MN, USA
  • fYear
    1991
  • fDate
    20-24 May 1991
  • Firstpage
    214
  • Abstract
    One of the major problems in current technology in the military environment is the identification of failures that occur in airborne electronics while on a mission that cannot be reproduced on the ground-in other words, return tested OK (RTOK). A module that monitors environmental conditions, real time, called the Time Stress Measurement Module (TSMM) is described. TSMM monitors environmental conditions affecting electronics modules and within electronic systems for test, maintenance, and AVIP purposes. The current TSMM provides for monitoring of temperatures, vibration, shock, voltage variations, and transients. The sensor data can be accessed across the PI-bus at any time before, during, or after a mission while the module is installed, allowing an expert system to take extreme environmental conditions and predict failures or correlate that data against failures that have already occurred. The sensor data can be retained after loss of power
  • Keywords
    aircraft instrumentation; computerised instrumentation; computerised monitoring; environmental testing; expert systems; fault location; military systems; shock measurement; stress measurement; temperature measurement; transients; voltage measurement; PI-bus; RTOK; Time Stress Measurement Module; airborne electronics; electronics modules; environmental conditions; expert system; failures; military electronics; monitoring; real time; repair; return tested OK; shock; temperatures; transients; vibration; voltage variations; Condition monitoring; Electric shock; Electronic equipment testing; Expert systems; Sensor systems; Stress measurement; System testing; Temperature measurement; Temperature sensors; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace and Electronics Conference, 1991. NAECON 1991., Proceedings of the IEEE 1991 National
  • Conference_Location
    Dayton, OH
  • Print_ISBN
    0-7803-0085-8
  • Type

    conf

  • DOI
    10.1109/NAECON.1991.165748
  • Filename
    165748