Liquid flow-through cooling for avionics applications

Author

Barwick, M. ; Midkiff, M. ; Seals, D.

Author_Institution

AT&T Bell Labs., Whippany, NJ, USA

fYear

1991

fDate

20-24 May 1991

Firstpage

227

Abstract

An avionics cooling system has been developed that circulates fluid through the structural frame of its SEM-E modules. The liquid flow-through (LFT) module frame is only 100 mils thick, yet is capable of maintaining low junction and surface temperatures for modules dissipating in excess of 200 W. The module form/factor is compatible with existing SEM-E circuit board formats and connectors and features toolless, dripless, quick-disconnect removal and insertion. A prototype avionics cooling system has been developed consisting of 52 LFT modules and a parallel feed rack/manifold. Both the module and the system have demonstrated outstanding cooling efficiency, and good reliability under preliminary shock and vibration testing. Cooling tests show a significant improvement over edge-conduction cooling. Thermal comparison tests indicate a 20°C improvement in frame surface temperature over an edge-conduction-cooled 50 W module

Keywords

aircraft instrumentation; cooling; 200 W; SEM-E modules; avionics cooling; efficiency; form/factor; liquid flow through cooling; module frame; parallel feed rack/manifold; prototype; reliability; surface temperatures; Aerospace electronics; Clocks; Electronics cooling; Microelectronics; Prototypes; Temperature; Thermal expansion; Thermal management; Thermal management of electronics; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Aerospace and Electronics Conference, 1991. NAECON 1991., Proceedings of the IEEE 1991 National

Conference_Location

Dayton, OH

Print_ISBN

0-7803-0085-8

Type

conf

DOI

10.1109/NAECON.1991.165750

Filename

165750