• DocumentCode
    2296945
  • Title

    Design and Fabrication of High-Temperature SOI Strain-Gauges

  • Author

    Kulha, P. ; Boura, A. ; Husak, M. ; Mikulik, P. ; Kucera, M. ; Valenda, S.

  • Author_Institution
    Dept. of Microelectron., Czech Tech. Univ. in Prague Tech., Prague
  • fYear
    2008
  • fDate
    12-16 Oct. 2008
  • Firstpage
    175
  • Lastpage
    178
  • Abstract
    The following paper introduces the coventor ware design environment for SOI based piezoresistive sensor design. Fabrication process and characterization of designed sensors is also presented. The software package Coventor Ware has been used for design of mechanical and electrical characteristics of the structure. The tools enable design, modelling and successive modification of designed MEMS structures. The program enables: drawing of 2D layout and its editing, simulation of production process, generation of 3D model from 2D masks, generation of network by the method offinite elements, solution of mechanical, piezoresistive, thermal and further simulations. Simple passive elements (strain sensitive resistors - piezoresistors) were fabricated on SIMOX SOI substrates with sputtered AlCuSi metallization. Basic parameter extraction and their temperature dependence were performed.
  • Keywords
    finite element analysis; microsensors; piezoresistive devices; silicon-on-insulator; strain gauges; 2D layout; AlCuSi metallization; CoventorWare design; MEMS structures; SIMOX SOI substrates; finite element method; high-temperature SOI strain-gauges; parameter extraction; piezoresistive sensor design; strain sensitive resistors; Capacitive sensors; Electric variables; Fabrication; Mechanical sensors; Micromechanical devices; Piezoresistance; Production; Resistors; Sensor phenomena and characterization; Software packages;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Devices and Microsystems, 2008. ASDAM 2008. International Conference on
  • Conference_Location
    Smolenice
  • Print_ISBN
    978-1-4244-2325-5
  • Electronic_ISBN
    978-1-4244-2326-2
  • Type

    conf

  • DOI
    10.1109/ASDAM.2008.4743310
  • Filename
    4743310