Title :
DRIE and Bonding Assisted Low Cost MEMS Processing of In-plane HAR Inertial Sensors
Author :
Rajaraman, V. ; Makinwa, K.A.A. ; French, P.J.
Author_Institution :
Dept. of Microelectron., Delft Univ. of Technol., Delft
Abstract :
We present a simple, flexible and low cost MEMS fabrication process, developed using deep reactive ion etching (DRIE) and wafer bonding technologies, for manufacturing in-plane high aspect ratio (HAR) inertial sensors. Among examples, the design and fabrication results of a two axis inertial device are presented. Fabricated device thickness ranged up to 140 mum and a HAR of 28 was obtained. Compared to the existing approaches reported in literature, the salient features of the presented process are: single-sided single-wafer processing using just two lithographic masks, capability to fabricate standalone MEMS as well as CMOS compatible MEMS post-processing via process variations, the use of plasma etching for wafer thinning that facilitates stictionless dry-release of MEMS, and its suitability for batch processing.
Keywords :
lithography; micromechanical devices; sensors; sputter etching; wafer bonding; CMOS compatible MEMS postprocessing; DRIE; batch processing; bonding assisted low cost MEMS processing; deep reactive ion etching; high aspect ratio; in-plane HAR inertial sensors; lithographic masks; plasma etching; single-sided single-wafer processing; two axis inertial device; wafer bonding technologies; wafer thinning; CMOS process; Costs; Etching; Fabrication; Flexible manufacturing systems; Manufacturing processes; Micromechanical devices; Plasma applications; Plasma materials processing; Wafer bonding;
Conference_Titel :
Advanced Semiconductor Devices and Microsystems, 2008. ASDAM 2008. International Conference on
Conference_Location :
Smolenice
Print_ISBN :
978-1-4244-2325-5
Electronic_ISBN :
978-1-4244-2326-2
DOI :
10.1109/ASDAM.2008.4743350
