Title :
Efficiency of dispenser with nozzle technology in assembly
Author :
Wang, Mu-Chun ; Huang, Kuo-Shu ; Chen, Shuang-Yuan ; Hsieh, Zhen-Ying ; Yang, Hsin-Chia ; Liu, Chuan-His ; Lin, Chii-Ruey
Author_Institution :
Dept. of Electron. Eng., Ming-Hsin Univ. of Sci. & Technol., Hsinchu, Taiwan
Abstract :
The material quality, species and orientation of nozzle usually dominate the throughput, bonding reliability and bonding yield of dispenser in bonding technology of assembly. Promoting these needs is a key factor to enter the fine-pitch package field and satisfies the high-density packaging competition.
Keywords :
lead bonding; nozzles; packaging; assembly; bonding reliability; bonding technology; bonding yield; dispenser; fine-pitch package field; high-density packaging; material quality; nozzle technology; Assembly; Bonding; Electronics packaging; Gold; Integrated circuits; Packaging; Wire;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5583781
