DocumentCode
2298096
Title
Efficiency of dispenser with nozzle technology in assembly
Author
Wang, Mu-Chun ; Huang, Kuo-Shu ; Chen, Shuang-Yuan ; Hsieh, Zhen-Ying ; Yang, Hsin-Chia ; Liu, Chuan-His ; Lin, Chii-Ruey
Author_Institution
Dept. of Electron. Eng., Ming-Hsin Univ. of Sci. & Technol., Hsinchu, Taiwan
fYear
2010
fDate
16-19 Aug. 2010
Firstpage
476
Lastpage
479
Abstract
The material quality, species and orientation of nozzle usually dominate the throughput, bonding reliability and bonding yield of dispenser in bonding technology of assembly. Promoting these needs is a key factor to enter the fine-pitch package field and satisfies the high-density packaging competition.
Keywords
lead bonding; nozzles; packaging; assembly; bonding reliability; bonding technology; bonding yield; dispenser; fine-pitch package field; high-density packaging; material quality; nozzle technology; Assembly; Bonding; Electronics packaging; Gold; Integrated circuits; Packaging; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4244-8140-8
Type
conf
DOI
10.1109/ICEPT.2010.5583781
Filename
5583781
Link To Document