High frequency resistance calculation and modeling of Through Silicon Vias

Through Silicon Via (TSV) is the primary interconnection technology in three dimensional integrated circuits (3DICs). The high frequency resistance of the TSV needs to be calculated and modeled. In this paper, the high resistance value is calculated by the simplify Bessel function, and increases proportionally to the square root of frequency, it is frequency dependent but not compatible to SPICE tools. A frequency independent three deep resistor and inductor ladder was proposed to model the frequency dependent resistance property of the TSV. The results denote that the model has high accuracy.