• DocumentCode
    2298528
  • Title

    Flicker noise in nanoscale pMOSFETs with mobility enhancement engineering and dynamic body biases

  • Author

    Yeh, Kuo-Liang ; Ku, Chih-You ; Hong, Wei-Lun ; Guo, Jyh-Chyurn

  • Author_Institution
    Inst. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2009
  • fDate
    7-9 June 2009
  • Firstpage
    347
  • Lastpage
    350
  • Abstract
    The uni-axial compressive strain from e-SiGe S/D combined with dynamic body biases effect on flicker noise of pMOSFETs is presented in this paper. This compressive strain contributes higher mobility but the worse flicker noise in terms of higher SID/ID 2 becomes a potential killer to RF/analog circuits. Forward body biases (FBB) can reduce the flicker noise but the degraded body bias effect in strained pMOSFETs makes it not as efficient as the standard ones without strain. Hooge´s mobility fluctuation model is adopted to explain the uni-axial strain and dynamic body biases effect on flicker noise. The increase of Hooge parameter alphaH is identified the key factor responsible the degraded flicker noise in strained pMOSFETs.
  • Keywords
    Ge-Si alloys; MOSFET; analogue integrated circuits; carrier mobility; flicker noise; nanoelectronics; radiofrequency integrated circuits; semiconductor device models; semiconductor device noise; semiconductor device reliability; semiconductor device testing; semiconductor materials; stress analysis; Hooge parameter; Hooge´s mobility fluctuation model; RF/analog circuits; SiGe; compressive strain; dynamic body biases effect; mobility enhancement engineering; nanoscale pMOSFET flicker noise; strained pMOSFETs; uni-axial compressive strain; uni-axial strain; 1f noise; Analog circuits; CMOS technology; Capacitive sensors; Cutoff frequency; Degradation; Germanium silicon alloys; MOSFETs; Radio frequency; Silicon germanium; Flicker noise; body bias; mobility; pMOSFET; strain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio Frequency Integrated Circuits Symposium, 2009. RFIC 2009. IEEE
  • Conference_Location
    Boston, MA
  • ISSN
    1529-2517
  • Print_ISBN
    978-1-4244-3377-3
  • Electronic_ISBN
    1529-2517
  • Type

    conf

  • DOI
    10.1109/RFIC.2009.5135555
  • Filename
    5135555