DocumentCode
2298528
Title
Flicker noise in nanoscale pMOSFETs with mobility enhancement engineering and dynamic body biases
Author
Yeh, Kuo-Liang ; Ku, Chih-You ; Hong, Wei-Lun ; Guo, Jyh-Chyurn
Author_Institution
Inst. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear
2009
fDate
7-9 June 2009
Firstpage
347
Lastpage
350
Abstract
The uni-axial compressive strain from e-SiGe S/D combined with dynamic body biases effect on flicker noise of pMOSFETs is presented in this paper. This compressive strain contributes higher mobility but the worse flicker noise in terms of higher SID/ID 2 becomes a potential killer to RF/analog circuits. Forward body biases (FBB) can reduce the flicker noise but the degraded body bias effect in strained pMOSFETs makes it not as efficient as the standard ones without strain. Hooge´s mobility fluctuation model is adopted to explain the uni-axial strain and dynamic body biases effect on flicker noise. The increase of Hooge parameter alphaH is identified the key factor responsible the degraded flicker noise in strained pMOSFETs.
Keywords
Ge-Si alloys; MOSFET; analogue integrated circuits; carrier mobility; flicker noise; nanoelectronics; radiofrequency integrated circuits; semiconductor device models; semiconductor device noise; semiconductor device reliability; semiconductor device testing; semiconductor materials; stress analysis; Hooge parameter; Hooge´s mobility fluctuation model; RF/analog circuits; SiGe; compressive strain; dynamic body biases effect; mobility enhancement engineering; nanoscale pMOSFET flicker noise; strained pMOSFETs; uni-axial compressive strain; uni-axial strain; 1f noise; Analog circuits; CMOS technology; Capacitive sensors; Cutoff frequency; Degradation; Germanium silicon alloys; MOSFETs; Radio frequency; Silicon germanium; Flicker noise; body bias; mobility; pMOSFET; strain;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio Frequency Integrated Circuits Symposium, 2009. RFIC 2009. IEEE
Conference_Location
Boston, MA
ISSN
1529-2517
Print_ISBN
978-1-4244-3377-3
Electronic_ISBN
1529-2517
Type
conf
DOI
10.1109/RFIC.2009.5135555
Filename
5135555
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