• DocumentCode
    2298567
  • Title

    Dielectric properties of Ni/poly(vinylidene fluoride) composites at high frequencies

  • Author

    He, Guangsen ; Zhao, Tao ; Sun, Rong ; Yu, Shuhui ; Du, Ruxu

  • Author_Institution
    Shenzhen Institutes of Adv. Integration Technol., Chinese Univ. of Hong Kong, Shenzhen, China
  • fYear
    2010
  • fDate
    16-19 Aug. 2010
  • Firstpage
    452
  • Lastpage
    455
  • Abstract
    The metal-polymer composites can possess a high dielectric constant with low filler content, and preserve the flexibility of the polymer matrix. Nickel (Ni) powder could be cheaply obtained through aqueous chemical reduction and not easily oxidized in air. In this study, composites of poly(vinylidene fluoride) (PVDF) filled with 0.7μm (average size) of metallic particles of nickel (Ni) were prepared via a grinding and hot-molding technique. The peak crystallization temperature (Tcp) of the composites shifts by around 4.5°C, from ~128.5°C for PVDF to ~133°C for the composites with 10wt% filler. The crystallization data indicates that the crystallinity of PVDF decreases with the increase of Ni content. The dielectric permittivity of the composite filled with 65wt% Ni particles is 800 at the frequency of 107Hz, while the dielectric loss tangent is about 1.6. The reason of high dielectric constant could be explained by the microcapacitor model and percolative theory. The easy processing, flexibility, and high dielectric constant of the composites make the composites attractive for practical applications in embedded capacitors.
  • Keywords
    composite materials; nickel; permittivity; polymers; Ni/poly(vinylidene fluoride) composites; aqueous chemical reduction; crystallization data; dielectric permittivity; dielectric properties; grinding technique; high dielectric constant; hot-molding technique; low filler content; metal-polymer composites; metallic particles; polymer matrix; Crystallization; Dielectric constant; Nickel; Permittivity; Polymers; Powders;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4244-8140-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2010.5583809
  • Filename
    5583809