Title :
Chip-scale optical interconnects based on hybrid integrated multiple quantum well devices
Author :
Gu, Tian ; Nair, Rohit ; Haney, Michael W.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE, USA
Abstract :
Hybrid integrated chip-scale optical interconnects based on small-footprint coupling to surface-normal MQW devices are advanced. Refinements to the grayscale lithographic fabrication process provide a path to ultra-high-density seamless interfacing between the on- and off-chip domains.
Keywords :
integrated circuit interconnections; lithography; optical interconnections; quantum well devices; chip scale optical interconnects; grayscale lithographic fabrication process; hybrid integrated multiple quantum well devices; surface normal multiple quantum well; ultrahigh density seamless interfacing; Couplers; Modulation; Optical coupling; Optical interconnections; Optical waveguides; Quantum well devices; Silicon; Optical Interconnects; Photonic Integrated Circuits;
Conference_Titel :
Photonics Conference (IPC), 2012 IEEE
Conference_Location :
Burlingame, CA
Print_ISBN :
978-1-4577-0731-5
DOI :
10.1109/IPCon.2012.6358599
