Title :
Survey of non-destructive inspection methods for solder joint integrity
Author :
O´Conchuir, Dtgsun ; McCurdy, J. ; Casey, Vincent
Author_Institution :
Limerick Univ., Ireland
Abstract :
Non-destructive techniques for solder joint inspection are surveyed. Both commercially available systems and methods still under research are described. The techniques are divided into visual, thermal, X-ray, and acoustic inspection. The mode of operation for each method is described and its good and bad points are looked at. It is seen that each method is suited to a particular inspection need, and no one technique fulfils all the requirements for a perfect system
Keywords :
X-ray applications; acoustic applications; acoustic imaging; image sensors; infrared imaging; inspection; nondestructive testing; printed circuit testing; soldering; 3D vision; PCB testing; X-ray inspection; acoustic inspection; coloured light; holography; radiography; solder joint inspection; solder joint integrity; thermal inspection; visual inspection; Assembly; Board of Directors; Cameras; Circuit faults; Inspection; Printed circuits; Process design; Production; Soldering; Testing;
Conference_Titel :
Aerospace and Electronics Conference, 1991. NAECON 1991., Proceedings of the IEEE 1991 National
Conference_Location :
Dayton, OH
Print_ISBN :
0-7803-0085-8
DOI :
10.1109/NAECON.1991.165925
