DocumentCode
2301555
Title
Hybrid micromachined push-button switches
Author
Hiltmann, Kai ; Wolf, Eugen ; Sandmaier, Hermann
Author_Institution
HSG-IMIT, Villingen-Schwenningen, Germany
fYear
2003
fDate
8-10 Sept. 2003
Firstpage
219
Lastpage
222
Abstract
We have begun to develop a new generation of micromachined membrane switches which incorporate a silicon membrane component and a standard PCB substrate. These new devices are expected to be both more economic and better suited for later handling by the user. The main problem in the development process is seen in joining both materials.
Keywords
bonding processes; elemental semiconductors; membranes; micromachining; microswitches; printed circuits; silicon; MEMS; PCB substrate; Si; hybrid micromachined switches; material joining process; membrane switches; push-button switches; silicon machining; silicon membrane; Biomembranes; Bonding; Bridge circuits; Contacts; Costs; Etching; Metallization; Silicon; Switches; Telecommunication switching;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Contacts, 2003. Proceedings of the Forty-Ninth IEEE Holm Conference on
Print_ISBN
0-7803-7862-8
Type
conf
DOI
10.1109/HOLM.2003.1246501
Filename
1246501
Link To Document