Title :
Hybrid micromachined push-button switches
Author :
Hiltmann, Kai ; Wolf, Eugen ; Sandmaier, Hermann
Author_Institution :
HSG-IMIT, Villingen-Schwenningen, Germany
Abstract :
We have begun to develop a new generation of micromachined membrane switches which incorporate a silicon membrane component and a standard PCB substrate. These new devices are expected to be both more economic and better suited for later handling by the user. The main problem in the development process is seen in joining both materials.
Keywords :
bonding processes; elemental semiconductors; membranes; micromachining; microswitches; printed circuits; silicon; MEMS; PCB substrate; Si; hybrid micromachined switches; material joining process; membrane switches; push-button switches; silicon machining; silicon membrane; Biomembranes; Bonding; Bridge circuits; Contacts; Costs; Etching; Metallization; Silicon; Switches; Telecommunication switching;
Conference_Titel :
Electrical Contacts, 2003. Proceedings of the Forty-Ninth IEEE Holm Conference on
Print_ISBN :
0-7803-7862-8
DOI :
10.1109/HOLM.2003.1246501
