DocumentCode :
2301700
Title :
A 30000 gate ECL gate array using advanced single poly technology and four level metal interconnect
Author :
Ganschow, George ; Lee, Lun-Hui ; Ho, Larry ; Truong, Mau ; Haas, Fred ; Joshi, Shailendra P. ; Smith, Peter ; Jerome, Rick ; Lahri, R. ; Bouknight, Lyle ; Biswal, Madan ; Lam, Nim
Author_Institution :
Nat. Semicond. Corp., Puyallup, WA, USA
fYear :
1990
fDate :
13-16 May 1990
Abstract :
The architecture and fabrication of a 30000 emitter coupled logic (ECL) gate array featuring a 90-ps unloaded gate delay are described. Current mode logic (CML) and ECL macros can be combined on custom-defined chips to minimize power without compromising the performance. The product has a channelless ocean-of-cells architecture permitting 100% cell utilization with ECL 100 K and 10 K I/O interface. The gate array is fabricated using ASPECT-II (advanced single poly emitter coupled technology) with silicided polysilicon local interconnect and four-level metallization.<>
Keywords :
application specific integrated circuits; bipolar integrated circuits; cellular arrays; emitter-coupled logic; logic arrays; 90 ps; ASPECT-II; CML; ECL gate array; advanced single poly technology; channelless ocean-of-cells architecture; current mode logic; custom-defined chips; emitter coupled logic; fabrication; four level metal interconnect; multilevel metallisation; polycrystalline Si; silicided polysilicon local interconnect; unloaded gate delay; Delay; Dielectrics; Fabrication; Integrated circuit interconnections; Marine technology; Master-slave; Resistors; Routing; Temperature distribution; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference, 1990., Proceedings of the IEEE 1990
Conference_Location :
Boston, MA, USA
Type :
conf
DOI :
10.1109/CICC.1990.124659
Filename :
124659
Link To Document :
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