• DocumentCode
    2301700
  • Title

    A 30000 gate ECL gate array using advanced single poly technology and four level metal interconnect

  • Author

    Ganschow, George ; Lee, Lun-Hui ; Ho, Larry ; Truong, Mau ; Haas, Fred ; Joshi, Shailendra P. ; Smith, Peter ; Jerome, Rick ; Lahri, R. ; Bouknight, Lyle ; Biswal, Madan ; Lam, Nim

  • Author_Institution
    Nat. Semicond. Corp., Puyallup, WA, USA
  • fYear
    1990
  • fDate
    13-16 May 1990
  • Abstract
    The architecture and fabrication of a 30000 emitter coupled logic (ECL) gate array featuring a 90-ps unloaded gate delay are described. Current mode logic (CML) and ECL macros can be combined on custom-defined chips to minimize power without compromising the performance. The product has a channelless ocean-of-cells architecture permitting 100% cell utilization with ECL 100 K and 10 K I/O interface. The gate array is fabricated using ASPECT-II (advanced single poly emitter coupled technology) with silicided polysilicon local interconnect and four-level metallization.<>
  • Keywords
    application specific integrated circuits; bipolar integrated circuits; cellular arrays; emitter-coupled logic; logic arrays; 90 ps; ASPECT-II; CML; ECL gate array; advanced single poly technology; channelless ocean-of-cells architecture; current mode logic; custom-defined chips; emitter coupled logic; fabrication; four level metal interconnect; multilevel metallisation; polycrystalline Si; silicided polysilicon local interconnect; unloaded gate delay; Delay; Dielectrics; Fabrication; Integrated circuit interconnections; Marine technology; Master-slave; Resistors; Routing; Temperature distribution; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 1990., Proceedings of the IEEE 1990
  • Conference_Location
    Boston, MA, USA
  • Type

    conf

  • DOI
    10.1109/CICC.1990.124659
  • Filename
    124659