• DocumentCode
    2301746
  • Title

    Hybrid MOSFET/Driver for Ultra-Fast Switching

  • Author

    Tang, T. ; Burkhart, C.

  • Author_Institution
    Stanford Linear Accel. Center, Menlo Park, CA
  • fYear
    2008
  • fDate
    27-31 May 2008
  • Firstpage
    128
  • Lastpage
    130
  • Abstract
    The ultra-fast switching of power MOSFETs, in ~1 ns, is very challenging. This is largely due to the parasitic inductance that is intrinsic to commercial packages used for both MOSFETs and drivers. Parasitic gate and source inductance not only limit the voltage rise time on the MOSFET internal gate structure but can also cause the gate voltage to oscillate. This paper describes a hybrid approach that substantially reduces the parasitic inductance between the driver and MOSFET gate as well as between the MOSFET source and its external connection. A flip chip assembly is used to directly attach the die-form power MOSFET and driver on a PCB. The parasitic inductances are significantly reduced by eliminating bond wires and minimizing lead length. The experimental results demonstrate ultra-fast switching of the power MOSFET with excellent control of the gate-source voltage.
  • Keywords
    MOSFET circuits; driver circuits; field effect transistor switches; flip-chip devices; hybrid integrated circuits; inductance; switching circuits; die-form power MOSFET; flip chip assembly; gate-source voltage; hybrid MOSFET/driver; parasitic inductance; ultrafast switching; Assembly; Bonding; Driver circuits; Inductance; MOSFET circuits; Packaging; Power MOSFET; Switches; Voltage; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IEEE International Power Modulators and High Voltage Conference, Proceedings of the 2008
  • Conference_Location
    Las Vegas, NE
  • Print_ISBN
    978-1-4244-1534-2
  • Electronic_ISBN
    978-1-4244-1535-9
  • Type

    conf

  • DOI
    10.1109/IPMC.2008.4743596
  • Filename
    4743596