DocumentCode
2301746
Title
Hybrid MOSFET/Driver for Ultra-Fast Switching
Author
Tang, T. ; Burkhart, C.
Author_Institution
Stanford Linear Accel. Center, Menlo Park, CA
fYear
2008
fDate
27-31 May 2008
Firstpage
128
Lastpage
130
Abstract
The ultra-fast switching of power MOSFETs, in ~1 ns, is very challenging. This is largely due to the parasitic inductance that is intrinsic to commercial packages used for both MOSFETs and drivers. Parasitic gate and source inductance not only limit the voltage rise time on the MOSFET internal gate structure but can also cause the gate voltage to oscillate. This paper describes a hybrid approach that substantially reduces the parasitic inductance between the driver and MOSFET gate as well as between the MOSFET source and its external connection. A flip chip assembly is used to directly attach the die-form power MOSFET and driver on a PCB. The parasitic inductances are significantly reduced by eliminating bond wires and minimizing lead length. The experimental results demonstrate ultra-fast switching of the power MOSFET with excellent control of the gate-source voltage.
Keywords
MOSFET circuits; driver circuits; field effect transistor switches; flip-chip devices; hybrid integrated circuits; inductance; switching circuits; die-form power MOSFET; flip chip assembly; gate-source voltage; hybrid MOSFET/driver; parasitic inductance; ultrafast switching; Assembly; Bonding; Driver circuits; Inductance; MOSFET circuits; Packaging; Power MOSFET; Switches; Voltage; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
IEEE International Power Modulators and High Voltage Conference, Proceedings of the 2008
Conference_Location
Las Vegas, NE
Print_ISBN
978-1-4244-1534-2
Electronic_ISBN
978-1-4244-1535-9
Type
conf
DOI
10.1109/IPMC.2008.4743596
Filename
4743596
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