• DocumentCode
    2301905
  • Title

    Packaging and assembly for integrated photonics - the ePIXpack photonics packaging service

  • Author

    Zimmermann, L. ; Preve, G.B. ; Tekin, T. ; Rosin, T.

  • Author_Institution
    IHP Microelectron. GmbH, Frankfurt (Oder), Germany
  • fYear
    2010
  • fDate
    7-11 Nov. 2010
  • Firstpage
    167
  • Lastpage
    168
  • Abstract
    The photonics packaging platform ePIXpack serves the academic community with packaging & assembly developments in the area of integrated photonics. Here we shall review the concept of ePIXpack and some of their recent work.
  • Keywords
    electronics packaging; integrated optics; ePIXpack photonics packaging service; integrated photonics assembly; integrated photonics packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IEEE Photonics Society, 2010 23rd Annual Meeting of the
  • Conference_Location
    Denver, CO
  • ISSN
    -
  • Print_ISBN
    978-1-4244-5368-9
  • Electronic_ISBN
    -
  • Type

    conf

  • DOI
    10.1109/PHOTONICS.2010.5698811
  • Filename
    5698811
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2301905