Title :
Packaging and assembly for integrated photonics - the ePIXpack photonics packaging service
Author :
Zimmermann, L. ; Preve, G.B. ; Tekin, T. ; Rosin, T.
Author_Institution :
IHP Microelectron. GmbH, Frankfurt (Oder), Germany
Abstract :
The photonics packaging platform ePIXpack serves the academic community with packaging & assembly developments in the area of integrated photonics. Here we shall review the concept of ePIXpack and some of their recent work.
Keywords :
electronics packaging; integrated optics; ePIXpack photonics packaging service; integrated photonics assembly; integrated photonics packaging;
Conference_Titel :
IEEE Photonics Society, 2010 23rd Annual Meeting of the
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-5368-9
DOI :
10.1109/PHOTONICS.2010.5698811
