Title :
8th International Symposium on Quality Electronic Design-Title
Abstract :
The following topics are dealt with: quality electronic design; design for manufacturing; device and circuit reliability; power and thermal management; analog and mixed signal design; circuit quality and reliability; advances in timing and power in physical design; power-aware system design methodologies; electrical quality; analog and RF testing; low power circuits; package circuit co-design; high level optimization; interconnects and power grids; parametric variations in design; DFM statistics; timing test and reliability; variation analysis and design lithography and OPC; and design and modeling for soft error reliability
Keywords :
analogue circuits; circuit reliability; design for manufacture; integrated circuit interconnections; integrated circuit testing; lithography; low-power electronics; mixed analogue-digital integrated circuits; semiconductor device reliability; thermal management (packaging); DFM statistics; OPC; RF testing; analog design; analog testing; circuit reliability; design for manufacturing; device reliability; electrical quality; high level optimization; interconnects; lithography; low power circuits; mixed signal design; package circuit co-design; parametric variations; power aware system; power grids; power management; soft error reliability; thermal management; timing reliability; timing test; variation analysis; variation design;
Conference_Titel :
Quality Electronic Design, 2007. ISQED '07. 8th International Symposium on
Conference_Location :
San Jose, CA
Print_ISBN :
0-7695-2795-7
DOI :
10.1109/ISQED.2007.4
