DocumentCode :
2302490
Title :
High Breakdown Strength, High Dielectric Constant Composites for High Frequency Applications
Author :
Bearpark, T. ; Davies, J. ; Dunleavy, M. ; Dyke, H. ; Haq, S. ; Hucker, M. ; Rew, J.K. ; Trigg, C.
Author_Institution :
Adv. Technol. Centre, BAE Syst., Bristol
fYear :
2008
fDate :
27-31 May 2008
Firstpage :
280
Lastpage :
282
Abstract :
Dielectric materials used for high power applications currently tend to be based upon either bulk ceramics or liquids such as ethylene glycol-water mixtures. Both of these approaches suffer problems in use; ceramics have limited strength and are brittle, whilst liquid based materials have chemical compatibility and environmental issues and cannot be used in applications that require a solid-state solution. This paper outlines the design and fabrication of material systems that allow the achievement of high breakdown strength, high dielectric constant, low dielectric losses and good mechanical strength and toughness. The approach that has been taken to achieve this involves the use of novel proprietary methods to fabricate composite structures of sizes ranging from microns to several hundred millimetres. Control of the electrical properties is complex as it is necessary to tailor the dielectric constant, the breakdown strength and the loss component, which inherently have conflicting requirements, and the situation is exacerbated in the high frequency region of interest for our application in the MHz-GHz range. The properties obtained with these materials, on a large scale, have resulted in the achievement of significant increases in the available energy density. Breakdown strengths that were previously only seen in thin-film structures are now possible in large scale bulk structures. This paper gives an overview of the development and recent advances that have been made through the use of different ceramic/matrix combinations and the effect of microstructure and morphology on the electrical properties.
Keywords :
dielectric losses; electric breakdown; mechanical strength; permittivity; power capacitors; thin films; breakdown strength; bulk ceramics; capacitors; energy density; ethylene glycol-water mixtures; high breakdown strength; high dielectric constant composites; high frequency applications; low dielectric losses; mechanical strength; solid-state solution; thin-film structures; Ceramics; Chemicals; Dielectric breakdown; Dielectric constant; Dielectric losses; Dielectric materials; Frequency; High-K gate dielectrics; Large-scale systems; Liquids;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEEE International Power Modulators and High Voltage Conference, Proceedings of the 2008
Conference_Location :
Las Vegas, NE
Print_ISBN :
978-1-4244-1534-2
Electronic_ISBN :
978-1-4244-1535-9
Type :
conf
DOI :
10.1109/IPMC.2008.4743636
Filename :
4743636
Link To Document :
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