DocumentCode
2303710
Title
Doping effects on the electronic structures of Bi2Te3 and thermoelectric property
Author
Sugihara, Sunao ; Kawashima, Seiji ; Yonekura, Isaku ; Suzuki, Hiroaki ; Sekine, Rika
Author_Institution
Shonan Inst. of Technol., Fujisawa, Japan
fYear
1997
fDate
26-29 Aug 1997
Firstpage
63
Lastpage
67
Abstract
The electronic structures of n- and p- Bi2Te3 were clarified using the molecular orbital method of Discrete Variational Xα setting two kinds of cluster such as Bi7Te6 and Bi6Te7. The present computational study was focused on the changes of electronic structures by doping another atom to the original bismuth telluride. The computational results revealed bonding strength between atoms and contour map of electron density. The atoms of Bi and Sb possessing 6p or 5p electrons are polarized to be more positive than their formal charges when doping (original Bi2Te3 in the case of Bi), meanwhile Ag and Cu turned to be negative. The gaps between the occupied and unoccupied levels became smaller by doping the atoms such as Ag and Cu leading to a lower electrical resistivity. Furthermore, bond strength between the center-Bi and Te in the cluster 1 (C-1) enhanced due to doping Ag or Cu as well as that of the center-Te and Bi in the cluster 2 (C-2) did. We elucidated the experimental data including electrical resistivity and Seebeck coefficient associating with the calculated electronic structures
Keywords
Xalpha calculations; band structure; bismuth compounds; electron density; semiconductor materials; thermoelectric power; variational techniques; Bi2Te3; Bi6Te7 cluster; Bi7Te6 cluster; Discrete Variational Xα; Seebeck coefficient; bond strength; bonding strength; contour map; doping effects; electronic structures; molecular orbital method; thermoelectric property; Atomic layer deposition; Bismuth; Bonding forces; Doping; Electric resistance; Electrons; Polarization; Powders; Tellurium; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 1997. Proceedings ICT '97. XVI International Conference on
Conference_Location
Dresden
ISSN
1094-2734
Print_ISBN
0-7803-4057-4
Type
conf
DOI
10.1109/ICT.1997.666975
Filename
666975
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