Title :
ACA bonding technology for low cost electronics packaging applications-current status and remaining challenges
Author_Institution :
Dept. of Product Eng., Chalmers Univ. of Technol., Goteborg, Sweden
Abstract :
Anisotropically Conductive Adhesives (ACAs) have been used in electronics packaging for decades on glass substrate, and recently in contactless smart-card module assembly and for bare chip attach on flexible and rigid substrates. This paper summarises various technologies used in connection with ACA joining. A summary of our understanding on electrical, thermal, physical, chemical, environmental and cost behaviours of ACAs in conjunction with various packaging applications are elaborated. Finally, future research areas and remaining issues are pointed out
Keywords :
adhesives; failure analysis; flip-chip devices; integrated circuit bonding; packaging; surface mount technology; ACA bonding technology; SMT; anisotropically conductive adhesives; bare chip attach; chemical behaviour; contactless smart-card module assembly; cost behaviour; electrical behaviour; environmental behaviour; flexible substrates; flip-chip attach; glass substrate; low cost electronics packaging applications; physical behaviour; rigid substrates; thermal behaviour; Anisotropic magnetoresistance; Assembly; Bonding; Chemical technology; Conductive adhesives; Contacts; Costs; Electronic packaging thermal management; Electronics packaging; Glass;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Conference_Location :
Espoo
Print_ISBN :
0-7803-6460-0
DOI :
10.1109/ADHES.2000.860564
