DocumentCode
230400
Title
Group IV channels for 7nm FinFETs: Performance for SoCs power and speed metrics
Author
Bardon, M.G. ; Raghavan, Praveen ; Eneman, Geert ; Schuddinck, P. ; Dehan, M. ; Mercha, Abdelkarim ; Thean, A. ; Verkest, D. ; Steegen, A.
Author_Institution
Imec, Leuven, Belgium
fYear
2014
fDate
9-12 June 2014
Firstpage
1
Lastpage
2
Abstract
Smart Mobile SoCs combine the need for speed and for power efficiency. For the 7nm node, high-mobility materials (SiGe, Ge, and IIIV) are candidates to replace Si channels and continue speed improvement, but are more prone to leakage currents impacting active leakage power. Transport and voltages at scaled dimensions could also influence the benefit of higher mobility. We evaluate these aspects for group IV channels devices in the SoC context using an holistic approach over energy-delay metrics and in a node to node perspective. At the 7nm node, Ge devices are expected to reach 34% improvement in frequency at Vdd of 0.65V assuming a series resistance of 230 Ω-um can be reached. Low power complementary Si devices are needed to meet the active leakage budget of mobile SoCs.
Keywords
MOSFET; electron mobility; germanium; leakage currents; system-on-chip; FinFET; Ge; Si; SoC power performance; active leakage budget; active leakage power; group IV channel device; high-mobility material; holistic approach; leakage current; low power complementary silicon device; power efficiency; size 7 nm; smart mobile SoC; speed metrics; system-on-chip; voltage 0.65 V; FinFETs; Leakage currents; Mobile communication; Resistance; Silicon; System-on-chip; 7nm; DTCO;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2014 Symposium on
Conference_Location
Honolulu, HI
ISSN
0743-1562
Print_ISBN
978-1-4799-3331-0
Type
conf
DOI
10.1109/VLSIT.2014.6894380
Filename
6894380
Link To Document