• DocumentCode
    230400
  • Title

    Group IV channels for 7nm FinFETs: Performance for SoCs power and speed metrics

  • Author

    Bardon, M.G. ; Raghavan, Praveen ; Eneman, Geert ; Schuddinck, P. ; Dehan, M. ; Mercha, Abdelkarim ; Thean, A. ; Verkest, D. ; Steegen, A.

  • Author_Institution
    Imec, Leuven, Belgium
  • fYear
    2014
  • fDate
    9-12 June 2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Smart Mobile SoCs combine the need for speed and for power efficiency. For the 7nm node, high-mobility materials (SiGe, Ge, and IIIV) are candidates to replace Si channels and continue speed improvement, but are more prone to leakage currents impacting active leakage power. Transport and voltages at scaled dimensions could also influence the benefit of higher mobility. We evaluate these aspects for group IV channels devices in the SoC context using an holistic approach over energy-delay metrics and in a node to node perspective. At the 7nm node, Ge devices are expected to reach 34% improvement in frequency at Vdd of 0.65V assuming a series resistance of 230 Ω-um can be reached. Low power complementary Si devices are needed to meet the active leakage budget of mobile SoCs.
  • Keywords
    MOSFET; electron mobility; germanium; leakage currents; system-on-chip; FinFET; Ge; Si; SoC power performance; active leakage budget; active leakage power; group IV channel device; high-mobility material; holistic approach; leakage current; low power complementary silicon device; power efficiency; size 7 nm; smart mobile SoC; speed metrics; system-on-chip; voltage 0.65 V; FinFETs; Leakage currents; Mobile communication; Resistance; Silicon; System-on-chip; 7nm; DTCO;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2014 Symposium on
  • Conference_Location
    Honolulu, HI
  • ISSN
    0743-1562
  • Print_ISBN
    978-1-4799-3331-0
  • Type

    conf

  • DOI
    10.1109/VLSIT.2014.6894380
  • Filename
    6894380