Title :
Electric field effects in the production of ICA joints
Author :
Heuschkel, Mark D. ; Morris, James E.
Author_Institution :
Fac. of Electr. Eng. & Inf. Technol., Chemnitz Univ. of Technol., Germany
Abstract :
Concern over the use of toxic lead in electronic devices is driving research into lead free solder alloys and isotropic electrically conductive adhesives (ICAs). To replace the common solders with ICAs, it is both essential to know the behavior of the material during assembly process, and useful to be able to exert any form of control which will yield improved properties. The paper describes the possible influence of an electric field applied to the ICA during curing
Keywords :
adhesives; assembling; conducting polymers; electric field effects; electric resistance; filled polymers; heat treatment; packaging; ICA joints; assembly process; curing; electric field effects; isotropic electrically conductive adhesives; Assembly; Conductive adhesives; Curing; Electric resistance; Environmentally friendly manufacturing techniques; Independent component analysis; Lead; Production; Silver; Surface resistance;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Conference_Location :
Espoo
Print_ISBN :
0-7803-6460-0
DOI :
10.1109/ADHES.2000.860602
