DocumentCode
2304569
Title
Effect of cure temperature on impact resistance of conductive adhesives
Author
MacDavitt, Sean R. ; Morris, James E.
Author_Institution
T.J. Watson Sch. of Eng. & Appl. Sci., State Univ. of New York, Binghamton, NY, USA
fYear
2000
fDate
2000
Firstpage
221
Lastpage
224
Abstract
The experiments described look at the impact resistance of conductive adhesives. A standard drop test from 5 feet was used to test the adhesives. The goal of the experiments was to determine whether the adhesives successfully passed these tests. The effects of cure temperature on the mechanical bond of the adhesive are discussed as well. The focus of the results is on the effect of cure temperature on adhesion
Keywords
adhesion; adhesives; impact strength; plastic packaging; 5 feet; adhesion; conductive adhesives; cure temperature; impact resistance; mechanical bond; standard drop test; Absorption; Aluminum; Bonding; Conductive adhesives; Copper; Curing; Electric resistance; Electronics packaging; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Conference_Location
Espoo
Print_ISBN
0-7803-6460-0
Type
conf
DOI
10.1109/ADHES.2000.860605
Filename
860605
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