• DocumentCode
    2304577
  • Title

    Thermoelectric properties of p-type Bi-Sb-Te based material prepared by PIES method with conventional ball milling process

  • Author

    Kagawa, Shuzo ; Satake, Hideki ; Sakamoto, Masanori ; Yamamoto, Atsushi ; Ohta, Toshitaka

  • Author_Institution
    Technol. Dev. Lab., Kubota Corp., Japan
  • fYear
    1997
  • fDate
    26-29 Aug 1997
  • Firstpage
    85
  • Lastpage
    88
  • Abstract
    For the development of energy saving processes for producing thermoelectric materials, the PIES (Pulverized and Intermixed Elements Sintering) method is known as a suitable one. In this study, a high figure of merit p-type Bi-Sb-Te based thermoelectric material was obtained by the oxygen free PIES method. The electrical resistivity of p-type (Bi2Te3)0.175(Sb2Te 3)0.825 material was reduced to 0.8×10-5 ohm m and Seebeck coefficient was obtained 2.4×10-4 V/K by fabrication in the oxygen free atmosphere process. The maximum ZT value was almost 1.0. Moreover, it was demonstrated that the improvement in figure of merit value was obtained even if the intermixed powder of elements was prepared by a conventional ball milling process in stead of the high energy ball milling process. The PIES methods using a low energy ball milling process is suitable for mass-production because of its cost efficiency
  • Keywords
    Seebeck effect; bismuth compounds; electrical resistivity; powder technology; semiconductor materials; sintering; (Bi2Te3)0.175(Sb2Te 3)0.825; Bi-Sb-Te; Seebeck coefficient; ball milling; electrical resistivity; figure of merit; intermixed powder; p-type semiconductor; pulverising; sintering; thermoelectric materials; Atmosphere; Ball milling; Electric resistance; Fabrication; Nitrogen; Powders; Power generation; Pressing; Temperature; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1997. Proceedings ICT '97. XVI International Conference on
  • Conference_Location
    Dresden
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-4057-4
  • Type

    conf

  • DOI
    10.1109/ICT.1997.666980
  • Filename
    666980