• DocumentCode
    2304903
  • Title

    Solder ball connection reliability model and critical parameter optimization

  • Author

    Phelan, G. ; Wang, S.

  • fYear
    1993
  • fDate
    1-4 Jun 1993
  • Firstpage
    858
  • Lastpage
    862
  • Abstract
    Surface mount array packages have been qualified by IBM for up to 625 I/O. Array packages are difficult to inspect and cannot be repaired at card assembly. Therefore, in order to ensure reliable joints, the critical process parameters have been determined. A model was obtained in which the reliability of the product can be predicted from actual build values of the critical parameters. Control of the critical parameters can ensure product quality
  • Keywords
    Assembly; Capacitive sensors; Ceramics; Electronics industry; Electronics packaging; Lead; Predictive models; Space technology; Surface-mount technology; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1993. Proceedings., 43rd
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-0794-1
  • Type

    conf

  • DOI
    10.1109/ECTC.1993.346683
  • Filename
    346683
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2304903