Title :
Advanced environmental friendly materials for HDI applications
Author :
Hanamura, Kenichiro ; Honda, Nobuyuki ; Suzuki, Tetsuaki ; Aoki, Masamitsu
Author_Institution :
Div. of Electr. Parts & Mater. Eng., Toshiba Chem. Corp., Kawaguchi, Japan
Abstract :
In reflection of increased environmental consciousness the world over, consideration toward the environment is becoming essential even in the case of electric/electronic equipment. In printed wiring board (PWB) materials brominated flame-retardants are used, and as a result there is concern that dioxin may be generated during combustion. We tackled the development of new flame-retarding method, and we have developed halogen-free FR-4 and resin coated copper foil. Meanwhile, a tendency is also seen to regulate lead within solder, causing progress in the development of lead-free solder. In this paper, we describe the effects of halogen-free materials on the lead-free solder process
Keywords :
copper; design for environment; flameproofing; interconnections; laminates; polymer films; printed circuit design; printed circuit manufacture; Cu; HDI applications; PWB materials; environmental friendly materials; flame-retarding method; glass epoxy Cu-clad laminates; halogen-free FR-4; halogen-free materials; heat resistance; high density interconnect; lead-free solder process; printed wiring board materials; resin coated Cu foil; Chemicals; Conducting materials; Environmentally friendly manufacturing techniques; Flame retardants; Glass; Lead; Resins; Resistance heating; Safety; Wiring;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Conference_Location :
Espoo
Print_ISBN :
0-7803-6460-0
DOI :
10.1109/ADHES.2000.860624
