Title :
Processing, structural and electrical properties of electrically conductive adhesives
Author :
Kim, Hansoo ; Li, Li ; Lizzul, Christine ; Sacolick, Isaac ; Morris, J.E.
Author_Institution :
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
Abstract :
There is growing interest in the potential of electrically conducting metal-loaded polymer adhesives for solder replacement in electrical lead attachment. Eight commercial electrically conductive adhesive (ECA) pastes were selected for study, including both thermosetting and thermoplastic examples. All were silver based, except for one nickel-polymer composite
Keywords :
adhesion; conducting polymers; electrical resistivity; filled polymers; lead bonding; plastic packaging; polymer structure; DC resistance; bulk resistivity; electrical lead attachment; electrical properties; electrically conductive adhesives; frequency dependence; metal-loaded polymer adhesives; nickel-polymer composite; nonohmic behavior; resistivity temperature dependence; silver-polymer composite; solder replacement; structural properties; thermoplastic paste; thermosetting paste; Assembly; Circuit testing; Conductive adhesives; Conductivity; Costs; Lead; Polymers; Silver; Temperature sensors; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346687
