Title :
A heuristic force-height equation for molten axisymmetric solder joints
Author_Institution :
IBM Corp., Hopewell Junction, NY
Abstract :
A heuristic equation is developed which relates the height of a molten joint to its surface tension, geometric constraints, and the applied force. In its present state, the equation is valid only for heights varying up to 10% from the zero-load shape, although a method is suggested to extend this range. The equation agrees well with published data derived from an exact solution, and with the data from a small laboratory experiment. The equation is intended as a practical tool for packaging engineers and designers who do not have access to the software needed to obtain the exact solution
Keywords :
flip-chip devices; integrated circuit interconnections; integrated circuit packaging; soldering; surface mount technology; surface tension; SMT; applied force; flip chip attachment; geometric constraints; heuristic force-height equation; molten axisymmetric solder joints; packaging engineers; solder interconnections; surface tension; zero-load shape; Electronics industry; Equations; Fatigue; Flip chip; Force measurement; Laboratories; Shape measurement; Soldering; Surface tension; Surface-mount technology;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346694
