Cooperative application of holography and finite element modeling in determining critical vibration behavior of printed wiring boards

Author

Blair, Howard D. ; Jih, Edward E J ; Brown, Gordon M. ; Pan, Tsung-Yu

Author_Institution

Ford Motor Co., Dearborn, MI, USA

fYear

1993

fDate

1-4 Jun 1993

Firstpage

1115

Lastpage

1119

Abstract

A PWB (printed wiring board) with dimensions of 6.5"×5.5" and attached with several bolts along the perimeter as constraints was acoustically vibrated and studied using CAH (computer-aided holometry). The frequency and shape of the first (primary) and second resonant modes, revealing the full field displacements and strains of the PWBs, were recorded automatically. Zero-displacement regions were also recorded for possible locations of strategic components. Finite element (FE) modeling using eigenvalue calculations was applied to correlate with the CAH results. Adjusting the boundary conditions in the modeling effort so as to match the experimental results proved to be the tricky task in the FE analysis since the mode shapes were extremely sensitive to boundary constraints

Keywords

circuit reliability; dynamic testing; eigenvalues and eigenfunctions; finite element analysis; holography; printed circuit testing; 5.5 in; 6.5 in; acoustic vibration; boundary conditions; boundary constraints; computer-aided holometry; critical vibration behavior; eigenvalue calculations; finite element modeling; holography; mode shapes; printed wiring boards; resonant modes; zero-displacement regions; Application software; Capacitive sensors; Eigenvalues and eigenfunctions; Fasteners; Finite element methods; Frequency; Holography; Resonance; Shape; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346695

Filename

346695